
FOD814SD
ActiveTRANSISTOR OUTPUT OPTOCOUPLER, 1, 5 KV, 20 %, 50 MA, SURFACE MOUNT DIP, 4 ROHS COMPLIANT: YES
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FOD814SD
ActiveTRANSISTOR OUTPUT OPTOCOUPLER, 1, 5 KV, 20 %, 50 MA, SURFACE MOUNT DIP, 4 ROHS COMPLIANT: YES
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Technical Specifications
Parameters and characteristics for this part
| Specification | FOD814SD |
|---|---|
| Current - DC Forward (If) (Max) | 50 mA |
| Current - Output / Channel | 50 mA |
| Current Transfer Ratio (Max) | 300 % |
| Current Transfer Ratio (Min) [Min] | 20 % |
| Mounting Type | Surface Mount |
| Number of Channels | 1 |
| Operating Temperature [Max] | 105 ░C |
| Operating Temperature [Min] | -55 °C |
| Output Type | 1.81 mOhm |
| Package / Case | 4-SMD, Gull Wing |
| Rise / Fall Time (Typ) [custom] | 3 µs |
| Rise / Fall Time (Typ) [custom] | 4 µs |
| Supplier Device Package | 4-SMD |
| Vce Saturation (Max) | 200 mV |
| Voltage - Output (Max) [Max] | 70 V |
FOD814A Series
4-Pin DIP Phototransistor Optocouplers
| Part | Supplier Device Package | Current - DC Forward (If) (Max) | Current - Output / Channel | Number of Channels | Mounting Type | Current Transfer Ratio (Min) [Min] | Operating Temperature [Max] | Operating Temperature [Min] | Vce Saturation (Max) | Output Type | Rise / Fall Time (Typ) [custom] | Rise / Fall Time (Typ) [custom] | Package / Case | Current Transfer Ratio (Max) [Max] | Voltage - Output (Max) [Max] | Current Transfer Ratio (Max) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
ON Semiconductor | 4-SMD | 50 mA | 50 mA | 1 | Surface Mount | 50 % | 105 ░C | -55 °C | 200 mV | 1.81 mOhm | 3 µs | 4 µs | 4-SMD Gull Wing | 150 % | 70 V | |
ON Semiconductor | 4-DIP | 50 mA | 50 mA | 1 | Through Hole | 20 % | 105 ░C | -55 °C | 200 mV | 1.81 mOhm | 3 µs | 4 µs | 4-DIP (0.300" 7.62mm) | 70 V | 300 % | |
ON Semiconductor | 4-SMD | 50 mA | 50 mA | 1 | Surface Mount | 50 % | 105 ░C | -55 °C | 200 mV | 1.81 mOhm | 3 µs | 4 µs | 4-SMD Gull Wing | 150 % | 70 V | |
ON Semiconductor | 4-DIP | 50 mA | 50 mA | 1 | Through Hole | 50 % | 105 ░C | -55 °C | 200 mV | 1.81 mOhm | 3 µs | 4 µs | 4-DIP (0.300" 7.62mm) | 150 % | 70 V | |
ON Semiconductor | 4-SMD | 50 mA | 50 mA | 1 | Surface Mount | 20 % | 105 ░C | -55 °C | 200 mV | 1.81 mOhm | 3 µs | 4 µs | 4-SMD Gull Wing | 70 V | 300 % | |
ON Semiconductor | 4-SMD | 50 mA | 50 mA | 1 | Surface Mount | 20 % | 105 ░C | -55 °C | 200 mV | 1.81 mOhm | 3 µs | 4 µs | 4-SMD Gull Wing | 70 V | 300 % | |
ON Semiconductor | 4-SMD | 50 mA | 50 mA | 1 | Surface Mount | 20 % | 105 ░C | -55 °C | 200 mV | 1.81 mOhm | 3 µs | 4 µs | 4-SMD Gull Wing | 70 V | 300 % | |
ON Semiconductor | 4-DIP | 50 mA | 50 mA | 1 | Through Hole | 20 % | 105 ░C | -55 °C | 200 mV | 1.81 mOhm | 3 µs | 4 µs | 4-DIP | 70 V | 300 % | |
ON Semiconductor | 4-SMD | 50 mA | 50 mA | 1 | Surface Mount | 50 % | 105 ░C | -55 °C | 200 mV | 1.81 mOhm | 3 µs | 4 µs | 4-SMD Gull Wing | 150 % | 70 V | |
ON Semiconductor | 4-DIP | 50 mA | 50 mA | 1 | Through Hole | 20 % | 105 ░C | -55 °C | 200 mV | 1.81 mOhm | 3 µs | 4 µs | 4-DIP | 70 V | 300 % |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Cut Tape (CT) | 1 | $ 0.64 | |
| 10 | $ 0.42 | |||
| 100 | $ 0.28 | |||
| Digi-Reel® | 1 | $ 0.64 | ||
| 10 | $ 0.42 | |||
| 100 | $ 0.28 | |||
| Tape & Reel (TR) | 1000 | $ 0.22 | ||
| 2000 | $ 0.19 | |||
| 5000 | $ 0.18 | |||
| 10000 | $ 0.18 | |||
| 25000 | $ 0.17 | |||
| 50000 | $ 0.17 | |||
| Newark | Each | 1 | $ 0.67 | |
| 10 | $ 0.41 | |||
| 100 | $ 0.25 | |||
| 500 | $ 0.23 | |||
| 1000 | $ 0.22 | |||
| 3000 | $ 0.19 | |||
| ON Semiconductor | N/A | 1 | $ 0.17 | |
Description
General part information
FOD814A Series
The FOD814 consists of two gallium arsenide infrared emitting diodes, connected in inverse parallel, driving a silicon phototransistor output in a 4-pin dual in-line package. The FOD817 Series consists of a gallium arsenide infrared emitting diode driving a silicon phototransistor in a 4-pin dual in-line package.