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Deep-Dive with AI
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Technical Specifications
Parameters and characteristics for this part
| Specification | FOD814W |
|---|---|
| Current - DC Forward (If) (Max) | 50 mA |
| Current - Output / Channel | 50 mA |
| Current Transfer Ratio (Max) | 300 % |
| Current Transfer Ratio (Min) [Min] | 20 % |
| Mounting Type | Through Hole |
| Number of Channels | 1 |
| Operating Temperature [Max] | 105 ░C |
| Operating Temperature [Min] | -55 °C |
| Output Type | 1.81 mOhm |
| Package / Case | 4-DIP |
| Rise / Fall Time (Typ) [custom] | 3 µs |
| Rise / Fall Time (Typ) [custom] | 4 µs |
| Supplier Device Package | 4-DIP |
| Vce Saturation (Max) | 200 mV |
| Voltage - Output (Max) [Max] | 70 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
Description
General part information
FOD814A Series
The FOD814 consists of two gallium arsenide infrared emitting diodes, connected in inverse parallel, driving a silicon phototransistor output in a 4-pin dual in-line package. The FOD817 Series consists of a gallium arsenide infrared emitting diode driving a silicon phototransistor in a 4-pin dual in-line package.
Documents
Technical documentation and resources