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ROHM RGT40NS65DGC9
Discrete Semiconductor Products

RGT50NS65DGC9

Active
Rohm Semiconductor

5ΜS SHORT-CIRCUIT TOLERANCE, 650V 25A, FRD BUILT-IN, TO-262, FIELD STOP TRENCH IGBT

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ROHM RGT40NS65DGC9
Discrete Semiconductor Products

RGT50NS65DGC9

Active
Rohm Semiconductor

5ΜS SHORT-CIRCUIT TOLERANCE, 650V 25A, FRD BUILT-IN, TO-262, FIELD STOP TRENCH IGBT

Technical Specifications

Parameters and characteristics for this part

SpecificationRGT50NS65DGC9
Current - Collector Pulsed (Icm)75 A
Gate Charge49 nC
IGBT TypeTrench Field Stop
Mounting TypeThrough Hole
Operating Temperature [Max]175 °C
Operating Temperature [Min]-40 C
Package / CaseTO-262AA, TO-262-3 Long Leads, I2PAK
Power - Max [Max]194 W
Reverse Recovery Time (trr)58 ns
Supplier Device PackageTO-262
Td (on/off) @ 25°C27 ns
Td (on/off) @ 25°C88 ns
Test Condition400 V, 25 A, 10 Ohm, 15 V
Vce(on) (Max) @ Vge, Ic2.1 V
Voltage - Collector Emitter Breakdown (Max)650 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTube 1$ 3.43
50$ 1.78
100$ 1.76
NewarkEach 1$ 3.57
10$ 2.87
25$ 2.37
50$ 1.86
100$ 1.83

Description

General part information

RGT50NS65D(TO-262) Series

ROHM's IGBT products will contribute to energy saving high efficiency and a wide range of high voltage and high-current applications.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

Compliance of the ELV directive

Environmental Data

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Moisture Sensitivity Level

Package Information

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Types and Features of Transistors

Application Note

Anti-Whisker formation

Package Information

4 Steps for Successful Thermal Designing of Power Devices

White Paper

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

How to Create Symbols for PSpice Models

Models

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

RGT50NS65D(TO-262) Data Sheet

Data Sheet

Generation Mechanism of Voltage Surge on Commutation Side (Basic)

Technical Article

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level

White Paper

Reliability Test Result

Manufacturing Data

What Is Thermal Design

Thermal Design

Explanation for Marking

Package Information

About Flammability of Materials

Environmental Data

About Export Administration Regulations (EAR)

Export Information

Semikron Danfoss: Partnering for the Safe Supply of Industrial Power Modules

White Paper