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144-LFBGA
Integrated Circuits (ICs)

MEC1609-PZP

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Microchip Technology

MIXED SIGNAL MOBILE EMBEDDED CONTROLLER WITH FLASH AND ARC CORE 144 LFBGA 10X10X1.4 TRAY ROHS COMPLIANT: YES

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144-LFBGA
Integrated Circuits (ICs)

MEC1609-PZP

Active
Microchip Technology

MIXED SIGNAL MOBILE EMBEDDED CONTROLLER WITH FLASH AND ARC CORE 144 LFBGA 10X10X1.4 TRAY ROHS COMPLIANT: YES

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Technical Specifications

Parameters and characteristics for this part

SpecificationMEC1609-PZP
ApplicationsI/O Controller
Core ProcessorARC-625D
InterfaceBC-Link, LPC, VLPC, ACPI, I2C/SMBus, SPI, PECI, PS/2
Mounting TypeSurface Mount
Number of I/O115
Operating Temperature [Max]70 °C
Operating Temperature [Min]0 °C
Package / Case144-LFBGA
Program Memory TypeFLASH
Program Memory Type192 kB
RAM Size16 K
Supplier Device Package144-LFBGA (10x10)
Voltage - Supply3.3 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTray 1$ 7.42
25$ 6.20
100$ 5.97
Microchip DirectTRAY 1$ 7.42
25$ 6.20
100$ 5.63
1000$ 5.43
5000$ 5.39
NewarkEach 100$ 5.80

Description

General part information

MEC1609 Series

This product is no longer available for sale. The MEC1609/MEC1609i is the mixed signal base component of a multi-device advanced I/O controller architecture.

It incorporates a high-performance 32-bit embedded microcontroller with a 192 Kilobyte embedded Flash subsystem, 16 Kilobytes of SRAM and 2 Kilobytes of instruction cache with an Advanced High-performance Bus (AHB), memory-mapped Serial Peripheral Interface (SPI) Flash Read Controller. MEC1609 communicates with the system host using the Intel® Low Pin Count bus. It is directly powered by two individual suspend supply planes (VBAT and VTR) and senses a third runtime power plane (VCC) to provide "instant on" and system power management functions.

**Family parts**