
MEC1609 Series
Manufacturer: Microchip Technology

MIXED SIGNAL MOBILE EMBEDDED CONTROLLER WITH FLASH AND ARC CORE 144 LFBGA 10X10X1.4 TRAY ROHS COMPLIANT: YES
| Part | RAM Size | Program Memory Type | Program Memory Type | Package / Case | Mounting Type | Voltage - Supply | Core Processor | Operating Temperature [Max] | Operating Temperature [Min] | Number of I/O | Interface | Applications | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology | 16 K | FLASH | 192 kB | 144-LFBGA | Surface Mount | 3.3 V | ARC-625D | 85 °C | -40 °C | 115 | ACPI BC-Link I2C/SMBus LPC PECI PS/2 SPI VLPC | I/O Controller | 144-LFBGA (10x10) |
Microchip Technology | 16 K | FLASH | 192 kB | 144-TFBGA | Surface Mount | 3.3 V | ARC-625D | 70 °C | 0 °C | 115 | ACPI BC-Link I2C/SMBus LPC PECI PS/2 SPI VLPC | I/O Controller | 144-TFBGA (7x7) |
Microchip Technology | 16 K | FLASH | 192 kB | 144-LFBGA | Surface Mount | 3.3 V | ARC-625D | 70 °C | 0 °C | 115 | ACPI BC-Link I2C/SMBus LPC PECI PS/2 SPI VLPC | I/O Controller | 144-LFBGA (10x10) |