Specification	MBR8170TFSTXG

Capacitance @ Vr, F	237 pF
Current - Average Rectified (Io)	8 A
Current - Reverse Leakage @ Vr	30 µA
Mounting Type	Surface Mount
Operating Temperature - Junction [Max]	175 ░C
Operating Temperature - Junction [Min]	-55 C
Package / Case	8-PowerWDFN
Speed	200 mA, 500 ns
Supplier Device Package	8-WDFN (3.3x3.3)
Technology	Schottky
Voltage - DC Reverse (Vr) (Max) [Max]	170 V
Voltage - Forward (Vf) (Max) @ If	890 mV

MBR8170TFS Series

8A, 170V Schottky Rectifier in μ8-FL

Part	Capacitance @ Vr, F	Voltage - Forward (Vf) (Max) @ If	Current - Average Rectified (Io)	Operating Temperature - Junction [Max]	Operating Temperature - Junction [Min]	Technology	Speed	Current - Reverse Leakage @ Vr	Package / Case	Supplier Device Package	Voltage - DC Reverse (Vr) (Max) [Max]	Mounting Type
ON Semiconductor MBR8170TFSTWG	237 pF	890 mV	8 A	175 ░C	-55 C	Schottky	200 mA 500 ns	30 µA	8-PowerWDFN	8-WDFN (3.3x3.3)	170 V	Surface Mount
ON Semiconductor MBR8170TFSTXG	237 pF	890 mV	8 A	175 ░C	-55 C	Schottky	200 mA 500 ns	30 µA	8-PowerWDFN	8-WDFN (3.3x3.3)	170 V	Surface Mount
ON Semiconductor MBR8170TFSTBG	237 pF	890 mV	8 A	175 ░C	-55 C	Schottky	200 mA 500 ns	30 µA	8-PowerWDFN	8-WDFN (3.3x3.3)	170 V	Surface Mount

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Cut Tape (CT)	1	$ 1.11
		10	$ 0.91
		100	$ 0.71
		500	$ 0.60
		1000	$ 0.49
		2000	$ 0.46
	Digi-Reel®	1	$ 1.11
		10	$ 0.91
		100	$ 0.71
		500	$ 0.60
		1000	$ 0.49
		2000	$ 0.46
	Tape & Reel (TR)	5000	$ 0.44
		10000	$ 0.42
Newark	Each	2500	$ 0.45
		10000	$ 0.43
ON Semiconductor	N/A	1	$ 0.44

Description

General part information

MBR8170TFS Series

This Schottky rectifier is high performance device in μ8-FL package. The lower forward voltage, less leakage current, and small junction capacitance is suitable for high switching frequency high density DC to DC conversion application. Offering higher avalanche energy capability for Oring or reverse protection application. The μ8-FL package provides an excellent thermal performance, less land area of board space, and low profile.