Zenode.ai Logo
Beta
TO-247N
Discrete Semiconductor Products

RGWX5TS65DHRC11

Active
Rohm Semiconductor

HIGH-SPEED FAST SWITCHING TYPE, 650V 75A, FRD BUILT-IN, TO-247N, FIELD STOP TRENCH IGBT FOR AUTOMOTIVE

Deep-Dive with AI

Search across all available documentation for this part.

TO-247N
Discrete Semiconductor Products

RGWX5TS65DHRC11

Active
Rohm Semiconductor

HIGH-SPEED FAST SWITCHING TYPE, 650V 75A, FRD BUILT-IN, TO-247N, FIELD STOP TRENCH IGBT FOR AUTOMOTIVE

Technical Specifications

Parameters and characteristics for this part

SpecificationRGWX5TS65DHRC11
Current - Collector (Ic) (Max)132 A
Current - Collector Pulsed (Icm)300 A
Gate Charge213 nC
IGBT TypeTrench Field Stop
Mounting TypeThrough Hole
Operating Temperature [Max]175 °C
Operating Temperature [Min]-40 C
Package / CaseTO-247-3
Reverse Recovery Time (trr)92 ns
Supplier Device PackageTO-247N
Td (on/off) @ 25°C [custom]237 ns
Td (on/off) @ 25°C [custom]62 ns
Test Condition15 V, 400 V, 37.5 A, 10 Ohm
Vce(on) (Max) @ Vge, Ic1.9 V
Voltage - Collector Emitter Breakdown (Max)650 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTube 1$ 7.67
10$ 5.21
450$ 3.24
900$ 3.22
NewarkEach 1$ 7.72
10$ 5.38
25$ 5.36
50$ 5.15
100$ 4.93
250$ 4.34
900$ 4.26

Description

General part information

RGWX5TS65EHR Series

RGWX5TS65EHR is a IGBT with low collector - emitter saturation voltage, suitable for On & Off Board Chargers, DC-DC Converters, PFC, Industrial Inverter. This product complies AEC-Q101 qualification. The RGW series features high-speed switching, contributing to higher efficiency of applications.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Semikron Danfoss: Partnering for the Safe Supply of Industrial Power Modules

White Paper

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Two-Resistor Model for Thermal Simulation

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Anti-Whisker formation

Package Information

Judgment Criteria of Thermal Evaluation

Thermal Design

RGWX5TS65DHR Data Sheet

Data Sheet

Generation Mechanism of Voltage Surge on Commutation Side (Basic)

Technical Article

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

How to Create Symbols for PSpice Models

Models

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level

White Paper

PCB Layout Thermal Design Guide

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

What Is Thermal Design

Thermal Design

About Export Administration Regulations (EAR)

Export Information

Method for Monitoring Switching Waveform

Schematic Design & Verification

Package Dimensions

Package Information

Types and Features of Transistors

Application Note

Notes for Temperature Measurement Using Thermocouples

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

About Flammability of Materials

Environmental Data

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Compliance of the ELV directive

Environmental Data

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Moisture Sensitivity Level

Package Information

4 Steps for Successful Thermal Designing of Power Devices

White Paper