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RGWX5TS65GC13
Discrete Semiconductor Products

RGWX5TS65GC13

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Rohm Semiconductor

HIGH-SPEED FAST SWITCHING TYPE, 650V 75A, TO-247N, FIELD STOP TRENCH IGBT

RGWX5TS65GC13
Discrete Semiconductor Products

RGWX5TS65GC13

Active
Rohm Semiconductor

HIGH-SPEED FAST SWITCHING TYPE, 650V 75A, TO-247N, FIELD STOP TRENCH IGBT

Technical Specifications

Parameters and characteristics for this part

SpecificationRGWX5TS65GC13
Current - Collector (Ic) (Max) [Max]132 A
Current - Collector Pulsed (Icm)300 A
Gate Charge213 nC
IGBT TypeTrench Field Stop
Mounting TypeThrough Hole
Operating Temperature [Max]175 °C
Operating Temperature [Min]-40 °C
Package / CaseTO-247-3
Power - Max [Max]348 W
Supplier Device PackageTO-247GE
Switching Energy1.68 mJ, 2.39 mJ
Td (on/off) @ 25°C64 ns, 229 ns
Test Condition10 Ohm, 400 V, 75 A, 15 V
Vce(on) (Max) @ Vge, Ic1.9 V
Voltage - Collector Emitter Breakdown (Max) [Max]650 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 600$ 7.72
Tube 1$ 6.29
10$ 5.68
25$ 5.41
120$ 4.70
360$ 4.49
600$ 4.09
1080$ 3.57
2520$ 3.43
NewarkEach 1$ 6.53
10$ 5.60
25$ 5.08
50$ 4.87
100$ 4.66
250$ 4.39

Description

General part information

RGWX5TS65 Series

RGWX5TS65DHR is a IGBT with low collector - emitter saturation voltage, suitable for On & Off Board Chargers, DC-DC Converters, PFC, Industrial Inverter. This product complies AEC-Q101 qualification. The RGW series features high-speed switching, contributing to higher efficiency of applications.

Documents

Technical documentation and resources

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Generation Mechanism of Voltage Surge on Commutation Side (Basic)

Technical Article

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

How to Create Symbols for PSpice Models

Models

Package Dimensions - TO-247GE

Package Information

Two-Resistor Model for Thermal Simulation

Thermal Design

What is a Thermal Model? (IGBT)

Thermal Design

About Flammability of Materials

Environmental Data

Judgment Criteria of Thermal Evaluation

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Types and Features of Transistors

Application Note

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Compliance of the ELV directive

Environmental Data

Moisture Sensitivity Level

Package Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

How to Use LTspice® Models

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

4 Steps for Successful Thermal Designing of Power Devices

White Paper

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Anti-Whisker formation

Package Information

Semikron Danfoss: Partnering for the Safe Supply of Industrial Power Modules

White Paper

About Export Administration Regulations (EAR)

Export Information

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Part Explanation

Application Note

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

What Is Thermal Design

Thermal Design

The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level

White Paper

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Estimation of switching losses in IGBTs operating with resistive load

Schematic Design & Verification

RGWX5TS65 Data Sheet

Data Sheet

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper