Integrated Circuits (ICs)

SN74LVC3G04DCUR

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3-CH, 1.65-V TO 5.5-V INVERTERS

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Documents16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B)CMOS Power Consumption and CPD Calculation (Rev. B)+26

Integrated Circuits (ICs)

SN74LVC3G04DCUR

Active

Texas Instruments

3-CH, 1.65-V TO 5.5-V INVERTERS

Deep-Dive with AI

Documents16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B)CMOS Power Consumption and CPD Calculation (Rev. B)+26

Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	SN74LVC3G04DCUR

Current - Output High, Low [x]	32 mA
Current - Output High, Low [y]	32 mA
Current - Quiescent (Max) [Max]	10 µA
Input Logic Level - High [Max]	2 V
Input Logic Level - High [Min]	1.7 V
Input Logic Level - Low [Max]	0.8 V
Input Logic Level - Low [Min]	0.7 V
Logic Type	Inverter
Max Propagation Delay @ V, Max CL	3.2 ns
Mounting Type	Surface Mount
Number of Circuits	3
Number of Inputs	3
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-40 °C
Package / Case	8-VFSOP
Package / Case [y]	2.3 mm
Package / Case [y]	0.091 in
Voltage - Supply [Max]	5.5 V
Voltage - Supply [Min]	1.65 V

SN74LVC3G04 Series

3-ch, 1.65-V to 5.5-V inverters

Part	Number of Inputs	Number of Circuits	Logic Type	Input Logic Level - High [Min]	Input Logic Level - High [Max]	Operating Temperature [Max]	Operating Temperature [Min]	Max Propagation Delay @ V, Max CL	Current - Quiescent (Max) [Max]	Voltage - Supply [Max]	Voltage - Supply [Min]	Input Logic Level - Low [Max]	Input Logic Level - Low [Min]	Mounting Type	Supplier Device Package	Current - Output High, Low [y]	Current - Output High, Low [x]	Package / Case	Package / Case [y]	Package / Case [y]	Supplier Device Package [y]	Supplier Device Package [x]
Texas Instruments SN74LVC3G04DCT3	3	3	Inverter	1.7 V	2 V	125 °C	-40 °C	3.8 ns	10 µA	5.5 V	1.65 V	0.8 V	0.7 V	Surface Mount	SM8	32 mA	32 mA
Texas Instruments SN74LVC3G04DCU6
Texas Instruments SN74LVC3G04YZPR	3	3	Inverter	1.7 V	2 V	125 °C	-40 °C	3.2 ns	10 µA	5.5 V	1.65 V	0.8 V	0.7 V	Surface Mount	8-DSBGA	32 mA	32 mA	8-XFBGA DSBGA
Texas Instruments SN74LVC3G04DCUR	3	3	Inverter	1.7 V	2 V	125 °C	-40 °C	3.2 ns	10 µA	5.5 V	1.65 V	0.8 V	0.7 V	Surface Mount		32 mA	32 mA	8-VFSOP	2.3 mm	0.091 in
Texas Instruments SN74LVC3G04YZAR	3	3	Inverter	1.7 V	2 V	125 °C	-40 °C	3.2 ns	10 µA	5.5 V	1.65 V	0.8 V	0.7 V	Surface Mount	8-DSBGA (1.9x0.9)	32 mA	32 mA	8-XFBGA DSBGA			0.9	1.9
Texas Instruments SN74LVC3G04DCURE4	3	3	Inverter	1.7 V	2 V	125 °C	-40 °C	3.2 ns	10 µA	5.5 V	1.65 V	0.8 V	0.7 V	Surface Mount		32 mA	32 mA	8-VFSOP	2.3 mm	0.091 in
Texas Instruments SN74LVC3G04DCUTG4	3	3	Inverter	1.7 V	2 V	125 °C	-40 °C	3.2 ns	10 µA	5.5 V	1.65 V	0.8 V	0.7 V	Surface Mount		32 mA	32 mA	8-VFSOP	2.3 mm	0.091 in
Texas Instruments SN74LVC3G04DCTR	3	3	Inverter	1.7 V	2 V	125 °C	-40 °C	3.2 ns	10 µA	5.5 V	1.65 V	0.8 V	0.7 V	Surface Mount	SM8	32 mA	32 mA

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Cut Tape (CT)	1	$ 0.60
		10	$ 0.51
		25	$ 0.48
		100	$ 0.38
		250	$ 0.36
		500	$ 0.30
		1000	$ 0.23
	Digi-Reel®	1	$ 0.60
		10	$ 0.51
		25	$ 0.48
		100	$ 0.38
		250	$ 0.36
		500	$ 0.30
		1000	$ 0.23
	Tape & Reel (TR)	3000	$ 0.21
		6000	$ 0.20
		15000	$ 0.19
		30000	$ 0.18
Newark	Each (Supplied on Cut Tape)	1	$ 0.52
		10	$ 0.49
		25	$ 0.47
		50	$ 0.45
		100	$ 0.43
		250	$ 0.42
		500	$ 0.41
		1000	$ 0.40
Texas Instruments	LARGE T&R	1	$ 0.27
		100	$ 0.21
		250	$ 0.15
		1000	$ 0.11

Description

General part information

SN74LVC3G04 Series

This triple inverter is designed for 1.65-V to 5.5-V VCCoperation. The SN74LVC3G04 device performs the Boolean function Y =A.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.