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SN74LVC3G04

SN74LVC3G04 Series

3-ch, 1.65-V to 5.5-V inverters

Manufacturer: Texas Instruments

Catalog

3-ch, 1.65-V to 5.5-V inverters

Key Features

Available in the Texas Instruments NanoFree PackageSupports 5-V VCCOperationInputs Accept Voltages to 5.5 VMax tpdof 4.1 ns at 3.3 VLow Power Consumption, 10-µA Max ICC±24-mA Output Drive at 3.3 VTypical VOLP(Output Ground Bounce)<0.8 V at VCC= 3.3 V, TA= 25°CTypical VOHV(Output VOHUndershoot)>2 V at VCC= 3.3 V, TA= 25°CIoffSupports Live Insertion, Partial-Power-Down Mode, and Back-Drive ProtectionCan Be Used as a Down Translator to Translate Inputs From a Max of 5.5 V Down to the VCCLevelLatch-Up Performance Exceeds 100 mA PerJESD 78, Class IIESD Protection Exceeds JESD 222000-V Human-Body Model (A114-A)200-V Machine Model (A115-A)1000-V Charged-Device Model (C101)Available in the Texas Instruments NanoFree PackageSupports 5-V VCCOperationInputs Accept Voltages to 5.5 VMax tpdof 4.1 ns at 3.3 VLow Power Consumption, 10-µA Max ICC±24-mA Output Drive at 3.3 VTypical VOLP(Output Ground Bounce)<0.8 V at VCC= 3.3 V, TA= 25°CTypical VOHV(Output VOHUndershoot)>2 V at VCC= 3.3 V, TA= 25°CIoffSupports Live Insertion, Partial-Power-Down Mode, and Back-Drive ProtectionCan Be Used as a Down Translator to Translate Inputs From a Max of 5.5 V Down to the VCCLevelLatch-Up Performance Exceeds 100 mA PerJESD 78, Class IIESD Protection Exceeds JESD 222000-V Human-Body Model (A114-A)200-V Machine Model (A115-A)1000-V Charged-Device Model (C101)

Description

AI
This triple inverter is designed for 1.65-V to 5.5-V VCCoperation. The SN74LVC3G04 device performs the Boolean function Y =A. NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is fully specified for partial-power-down applications using Ioff. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. This triple inverter is designed for 1.65-V to 5.5-V VCCoperation. The SN74LVC3G04 device performs the Boolean function Y =A. NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is fully specified for partial-power-down applications using Ioff. The Ioffcircuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.