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RB098BM-40FNSTL

Discrete Semiconductor Products

RF305BGE6STL

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Rohm Semiconductor

RECTIFIER, 600V, 3A, TO-252 ROHS COMPLIANT: YES

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Search across all available documentation for this part.

DocumentsBasics of Thermal Resistance and Heat Dissipation Power Loss and Thermal Design of Diodes +37

RB098BM-40FNSTL

Discrete Semiconductor Products

RF305BGE6STL

Active

Rohm Semiconductor

RECTIFIER, 600V, 3A, TO-252 ROHS COMPLIANT: YES

Deep-Dive with AI

DocumentsBasics of Thermal Resistance and Heat Dissipation Power Loss and Thermal Design of Diodes +37

Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	RF305BGE6STL

Current - Average Rectified (Io)	3 A
Current - Reverse Leakage @ Vr	10 µA
Mounting Type	Surface Mount
Operating Temperature - Junction	150 ¯C
Package / Case	TO-252-3, SC-63, DPAK (2 Leads + Tab)
Reverse Recovery Time (trr)	30 ns
Speed	500 ns, 200 mA
Supplier Device Package	TO-252GE
Technology	Standard
Voltage - DC Reverse (Vr) (Max) [Max]	600 V
Voltage - Forward (Vf) (Max) @ If [Max]	1.7 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Cut Tape (CT)	1	$ 2.01
		10	$ 1.28
		100	$ 0.87
		500	$ 0.69
		1000	$ 0.63
	Digi-Reel®	1	$ 2.01
		10	$ 1.28
		100	$ 0.87
		500	$ 0.69
		1000	$ 0.63
	N/A	2340	$ 2.00
	Tape & Reel (TR)	2500	$ 0.53
Newark	Each (Supplied on Cut Tape)	1	$ 1.97
		10	$ 1.28
		25	$ 1.14
		50	$ 1.00
		100	$ 0.87
		250	$ 0.78
		500	$ 0.69
		1000	$ 0.64

Description

General part information

RF305 Series

RF305BM6SFH is the silicon epitaxial planar type Fast Recovery Diode.

Documents

Technical documentation and resources

Basics of Thermal Resistance and Heat Dissipation

Power Loss and Thermal Design of Diodes

Diode Types and Applications

Technical Article

About Export Regulations

Export Information

Report of SVHC under REACH Regulation

Environmental Data

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Two-Resistor Model for Thermal Simulation

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

RF305BGE6S ESD Data

Characteristics Data

Notes for Temperature Measurement Using Forward Voltage of PN Junction

About Flammability of Materials

Environmental Data

How to Select Rectifier Diodes

Technical Article

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Anti-Whisker formation - Diodes

Package Information

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Judgment Criteria of Thermal Evaluation

List of Diode Package Thermal Resistance

RF305BGE6S Data Sheet

What is a Thermal Model? (Diode)

Reliability Test Result

Manufacturing Data

θ<sub>JC</sub> and Ψ<sub>JT</sub>

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Part Explanation

Application Note

What Is Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

PCB Layout Thermal Design Guide

Method for Monitoring Switching Waveform

Schematic Design & Verification

θ<sub>JA</sub> and Ψ<sub>JT</sub>

How to Create Symbols for PSpice Models

Notes for Calculating Power Consumption:Static Operation

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Notes for Temperature Measurement Using Thermocouples

How to Use LTspice® Models

Schematic Design & Verification

Compliance of the RoHS directive

Environmental Data

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Measurement Method and Usage of Thermal Resistance RthJC

Moisture Sensitivity Level - Diodes

Package Information

RF305 Series

Super Fast Recovery Diode (AEC-Q101 Qualified)

Part	Technology	Speed	Current - Reverse Leakage @ Vr	Package / Case	Reverse Recovery Time (trr)	Current - Average Rectified (Io)	Voltage - DC Reverse (Vr) (Max) [Max]	Supplier Device Package	Operating Temperature - Junction	Mounting Type	Voltage - Forward (Vf) (Max) @ If [Max]	Operating Temperature - Junction [Max]	Grade	Qualification
Rohm Semiconductor RF305BGE6STL	Standard	200 mA 500 ns	10 µA	DPAK (2 Leads + Tab) SC-63 TO-252-3	30 ns	3 A	600 V	TO-252GE	150 ¯C	Surface Mount	1.7 V
Rohm Semiconductor RF305B6STL	Standard	200 mA 500 ns		DPAK (2 Leads + Tab) SC-63 TO-252-3		3 A	600 V	CPD		Surface Mount		150 °C
Rohm Semiconductor RF305BM6SFHTL	Standard	200 mA 500 ns	10 µA	DPAK (2 Leads + Tab) SC-63 TO-252-3	30 ns	3 A	600 V	TO-252		Surface Mount	1.7 V	150 °C	Automotive	AEC-Q101
Rohm Semiconductor RF305BM6STL	Standard	200 mA 500 ns	10 µA	DPAK (2 Leads + Tab) SC-63 TO-252-3	30 ns	3 A	600 V	TO-252		Surface Mount	1.7 V	150 °C