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RB098BM-40FNSTL
Discrete Semiconductor Products

RF305BM6STL

Obsolete
Rohm Semiconductor

DIODE GEN PURP 600V 3A TO252

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RB098BM-40FNSTL
Discrete Semiconductor Products

RF305BM6STL

Obsolete
Rohm Semiconductor

DIODE GEN PURP 600V 3A TO252

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationRF305BM6STL
Current - Average Rectified (Io)3 A
Current - Reverse Leakage @ Vr10 µA
Mounting TypeSurface Mount
Operating Temperature - Junction150 °C
Package / CaseSC-63, DPAK (2 Leads + Tab), TO-252-3
Reverse Recovery Time (trr)30 ns
Speed200 mA, 500 ns
Supplier Device PackageTO-252
TechnologyStandard
Voltage - DC Reverse (Vr) (Max) [Max]600 V
Voltage - Forward (Vf) (Max) @ If1.7 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 1.60
10$ 1.01
100$ 0.67
500$ 0.53
1000$ 0.48
Digi-Reel® 1$ 1.02
10$ 0.83
100$ 0.65
500$ 0.55
1000$ 0.45
Tape & Reel (TR) 2500$ 0.42
5000$ 0.40
12500$ 0.38
25000$ 0.38

Description

General part information

RF305BM6SFH Series

RF305BM6SFH is the silicon epitaxial planar type Fast Recovery Diode.

Documents

Technical documentation and resources

Diode Flammability

Related Document

TO252 TL Taping Spec

Datasheet

TO-252 Part Marking

Related Document

About Export Regulations

Export Information

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

List of Diode Package Thermal Resistance

Thermal Design

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

What Is Thermal Design

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

ESD Data

Characteristics Data

Power Loss and Thermal Design of Diodes

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Reliability Test Result

Manufacturing Data

Diode Types and Applications

Technical Article

Two-Resistor Model for Thermal Simulation

Thermal Design

How to Select Rectifier Diodes

Technical Article

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

What is a Thermal Model? (Diode)

Thermal Design

Moisture Sensitivity Level - Diodes

Package Information

PCB Layout Thermal Design Guide

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

How to Create Symbols for PSpice Models

Models

Package Dimensions

Package Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Part Explanation

Application Note

RF305BM6S Data Sheet

Data Sheet

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design