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RB098BM-40FNSTL
Discrete Semiconductor Products

RF305BM6SFHTL

Active
Rohm Semiconductor

SUPER FAST RECOVERY DIODE (AEC-Q101 QUALIFIED)

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RB098BM-40FNSTL
Discrete Semiconductor Products

RF305BM6SFHTL

Active
Rohm Semiconductor

SUPER FAST RECOVERY DIODE (AEC-Q101 QUALIFIED)

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationRF305BM6SFHTL
Current - Average Rectified (Io)3 A
Current - Reverse Leakage @ Vr10 µA
GradeAutomotive
Mounting TypeSurface Mount
Operating Temperature - Junction150 °C
Package / CaseSC-63, DPAK (2 Leads + Tab), TO-252-3
QualificationAEC-Q101
Reverse Recovery Time (trr)30 ns
Speed200 mA, 500 ns
Supplier Device PackageTO-252
TechnologyStandard
Voltage - DC Reverse (Vr) (Max) [Max]600 V
Voltage - Forward (Vf) (Max) @ If1.7 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.94
10$ 0.77
100$ 0.60
500$ 0.51
1000$ 0.41
Digi-Reel® 1$ 0.94
10$ 0.77
100$ 0.60
500$ 0.51
1000$ 0.41
Tape & Reel (TR) 2500$ 0.35
NewarkEach (Supplied on Cut Tape) 1$ 0.98
10$ 0.75
25$ 0.69
50$ 0.64
100$ 0.59
300$ 0.53
500$ 0.47
1000$ 0.43

Description

General part information

RF305BM6SFH Series

RF305BM6SFH is the silicon epitaxial planar type Fast Recovery Diode.

Documents

Technical documentation and resources

Diode Flammability

Related Document

TO-252 Part Marking

Related Document

AEC-Q101 Automotive Requirements

Related Document

TO252 TL Taping Spec

Datasheet

Technical Data Sheet EN

Datasheet

Moisture Sensitivity Level - Diodes

Package Information

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Package Dimensions

Package Information

Diode Types and Applications

Technical Article

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Reliability Test Result

Manufacturing Data

What is a Thermal Model? (Diode)

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

What Is Thermal Design

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

How to Select Rectifier Diodes

Technical Article

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

PCB Layout Thermal Design Guide

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Power Loss and Thermal Design of Diodes

Thermal Design

Part Explanation

Application Note

Two-Resistor Model for Thermal Simulation

Thermal Design

List of Diode Package Thermal Resistance

Thermal Design

ESD Data

Characteristics Data

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

About Export Regulations

Export Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification