Specification	18-350000-10-HT

Board Material	Polyimide (PI)
Board Thickness	1.57 mm
Board Thickness	0.062 "
Contact Finish - Post	Tin-Lead
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Post [custom]	Brass
Convert From (Adapter End)	SOIC
Convert To (Adapter End)	7.62 mm
Convert To (Adapter End)	DIP
Convert To (Adapter End)	0.3 in
Material	FR4 Epoxy Glass
Mounting Type	Through Hole
Number of Pins	18
Number of Positions	18
Package Accepted	SOIC
Pitch	0.05 in
Pitch	1.27 mm
Pitch - Mating	1.27 mm
Pitch - Mating	0.05 in
Pitch - Post	0.1 in
Pitch - Post	2.54 mm
Proto Board Type	DIP to DIP
Termination	Solder
Termination Post Length	0.125 in
Termination Post Length	3.18 mm

18-3500 Series

Part	Board Thickness	Board Thickness	Board Thickness	Material	Number of Positions	Package Accepted	Proto Board Type	Pitch	Pitch	Size / Dimension [x]	Size / Dimension [y]	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Termination Post Length	Termination Post Length	Pitch - Mating	Pitch - Mating	Convert From (Adapter End)	Board Material	Contact Finish - Post	Termination	Mounting Type	Convert To (Adapter End)	Convert To (Adapter End)	Convert To (Adapter End)	Number of Pins	Contact Material - Post [custom]	Pitch - Post	Pitch - Post
Aries Electronics 18-350000-11-RC	1.57 mm	0.062 "	0.0625 in	FR4 Epoxy Glass	18	SOIC	SMD to DIP	0.05 in	1.27 mm	45.72 mm	11.43 mm
Aries Electronics 18-350000-10-HT	1.57 mm	0.062 "		FR4 Epoxy Glass	18	SOIC	DIP to DIP	0.05 in	1.27 mm			200 µin	5.08 µm	0.125 in	3.18 mm	1.27 mm	0.05 in	SOIC	Polyimide (PI)	Tin-Lead	Solder	Through Hole	7.62 mm	DIP	0.3 in	18	Brass	0.1 in	2.54 mm
Aries Electronics 18-350000-11-RC-P	1.57 mm	0.062 "	0.0625 in	FR4 Epoxy Glass	18	SOIC	SMD to DIP	0.05 in	1.27 mm	45.72 mm	11.43 mm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	N/A	0	$ 0.00