18-3500 Series
Manufacturer: Aries Electronics
Beta
⌘K
SOCKET ADAPTER SOIC TO 18DIP 0.3
| Part | Board Thickness | Board Thickness | Board Thickness | Material | Number of Positions | Package Accepted | Proto Board Type | Pitch | Pitch | Size / Dimension [x] | Size / Dimension [y] | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Termination Post Length | Termination Post Length | Pitch - Mating | Pitch - Mating | Convert From (Adapter End) | Board Material | Contact Finish - Post | Termination | Mounting Type | Convert To (Adapter End) | Convert To (Adapter End) | Convert To (Adapter End) | Number of Pins | Contact Material - Post [custom] | Pitch - Post | Pitch - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 1.57 mm | 0.062 " | 0.0625 in | FR4 Epoxy Glass | 18 | SOIC | SMD to DIP | 0.05 in | 1.27 mm | 45.72 mm | 11.43 mm | ||||||||||||||||||
 Aries Electronics | 1.57 mm | 0.062 " | FR4 Epoxy Glass | 18 | SOIC | DIP to DIP | 0.05 in | 1.27 mm | 200 µin | 5.08 µm | 0.125 in | 3.18 mm | 1.27 mm | 0.05 in | SOIC | Polyimide (PI) | Tin-Lead | Solder | Through Hole | 7.62 mm | DIP | 0.3 in | 18 | Brass | 0.1 in | 2.54 mm | |||
Aries Electronics | 1.57 mm | 0.062 " | 0.0625 in | FR4 Epoxy Glass | 18 | SOIC | SMD to DIP | 0.05 in | 1.27 mm | 45.72 mm | 11.43 mm |