Zenode.ai Logo
Beta
Product dimension image
Discrete Semiconductor Products

R6035ENZC17

Active
Rohm Semiconductor

600V 35A TO-3PF, LOW-NOISE POWER MOSFET

Deep-Dive with AI

Search across all available documentation for this part.

Product dimension image
Discrete Semiconductor Products

R6035ENZC17

Active
Rohm Semiconductor

600V 35A TO-3PF, LOW-NOISE POWER MOSFET

Technical Specifications

Parameters and characteristics for this part

SpecificationR6035ENZC17
Current - Continuous Drain (Id) @ 25°C35 A
Drain to Source Voltage (Vdss)600 V
Drive Voltage (Max Rds On, Min Rds On)10 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]110 nC
Input Capacitance (Ciss) (Max) @ Vds [Max]2720 pF
Mounting TypeThrough Hole
Operating Temperature150 °C
Package / CaseTO-3P-3 Full Pack
Power Dissipation (Max)120 W
Rds On (Max) @ Id, Vgs102 mOhm
Supplier Device PackageTO-3PF
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTube 1$ 3.36
30$ 1.87
120$ 1.71

Description

General part information

R6035KNZ4 Series

The R6xxxKNx series are high-speed switching products, Super Junction MOSFETs, that place an emphasis on high efficiency. This series products achieve higher efficiency via high-speed switching. High-speed switching makes it possible to contribute to higher efficiency in PFC and LLC circuits.

Documents

Technical documentation and resources

About Export Regulations

Export Information

What Is Thermal Design

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Types and Features of Transistors

Application Note

Constitution Materials List

Environmental Data

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Method for Monitoring Switching Waveform

Schematic Design & Verification

PCB Layout Thermal Design Guide

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

About Flammability of Materials

Environmental Data

What is a Thermal Model? (Transistor)

Thermal Design

Inner Structure

Package Information

R6035ENZ Data Sheet

Data Sheet

Moisture Sensitivity Level - Transistors

Package Information

Report of SVHC under REACH Regulation

Environmental Data

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Reliability Test Result

Manufacturing Data

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Part Explanation

Application Note

List of Transistor Package Thermal Resistance

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

How to Create Symbols for PSpice Models

Models

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design