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R6020ENZ4C13
Discrete Semiconductor Products

R6035KNZ4C13

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Rohm Semiconductor

600V 35A TO-247, HIGH-SPEED SWITCHING POWER MOSFET

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R6020ENZ4C13
Discrete Semiconductor Products

R6035KNZ4C13

Active
Rohm Semiconductor

600V 35A TO-247, HIGH-SPEED SWITCHING POWER MOSFET

Technical Specifications

Parameters and characteristics for this part

SpecificationR6035KNZ4C13
Current - Continuous Drain (Id) @ 25°C35 A
Drain to Source Voltage (Vdss)600 V
Drive Voltage (Max Rds On, Min Rds On)10 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs72 nC
Mounting TypeThrough Hole
Operating Temperature150 °C
Package / CaseTO-247-3
Power Dissipation (Max)379 W
Rds On (Max) @ Id, Vgs102 mOhm
Supplier Device PackageTO-247
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTube 1$ 10.22
30$ 6.05
120$ 5.14
510$ 4.69

Description

General part information

R6035KNZ4 Series

The R6xxxKNx series are high-speed switching products, Super Junction MOSFETs, that place an emphasis on high efficiency. This series products achieve higher efficiency via high-speed switching. High-speed switching makes it possible to contribute to higher efficiency in PFC and LLC circuits.

Documents

Technical documentation and resources

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Types and Features of Transistors

Application Note

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

What is a Thermal Model? (Transistor)

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

What Is Thermal Design

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

R6035KNZ4 Data Sheet

Data Sheet

PCB Layout Thermal Design Guide

Thermal Design

Package Dimensions

Package Information

Method for Monitoring Switching Waveform

Schematic Design & Verification

About Export Regulations

Export Information

About Flammability of Materials

Environmental Data

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

Explanation for Marking

Package Information

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Report of SVHC under REACH Regulation

Environmental Data

Part Explanation

Application Note

Moisture Sensitivity Level - Transistors

Package Information

Judgment Criteria of Thermal Evaluation

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

How to Create Symbols for PSpice Models

Models

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Notes for Temperature Measurement Using Thermocouples

Thermal Design