08-3500 Series

Part	Proto Board Type	Number of Positions	Material	Board Thickness	Board Thickness	Board Thickness	Package Accepted	Size / Dimension [x]	Size / Dimension [y]	Size / Dimension [y]	Size / Dimension [x]	Pitch	Pitch	Mounting Type	Termination	Convert From (Adapter End)	Convert To (Adapter End)	Convert To (Adapter End)	Convert To (Adapter End)	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Number of Pins	Board Material	Pitch - Post	Pitch - Post	Contact Material - Post [custom]	Termination Post Length	Termination Post Length	Pitch - Mating	Pitch - Mating	Contact Finish - Post
Aries Electronics 08-350000-10	SMD to DIP	8	FR4 Epoxy Glass	1.57 mm	0.062 "	0.0625 in	SOIC	20.32 mm	0.46 in	11.68 mm	0.8 "	0.05 in	1.27 mm
Aries Electronics 08-350000-10-HT	DIP to DIP	8	FR4 Epoxy Glass	1.57 mm	0.062 "		SOIC					0.05 in	1.27 mm	Through Hole	Solder	SOIC	7.62 mm	DIP	0.3 in	200 µin	5.08 µm	8	Polyimide (PI)	0.1 in	2.54 mm	Brass	0.125 in	3.18 mm	1.27 mm	0.05 in	Tin-Lead
Aries Electronics 08-350000-11-RC-P	SMD to DIP	8	FR4 Epoxy Glass	1.57 mm	0.062 "	0.0625 in	SOIC	20.32 mm	0.46 in	11.68 mm	0.8 "	0.05 in	1.27 mm
Aries Electronics 08-350000-10-P	SMD to DIP	8	FR4 Epoxy Glass	1.57 mm	0.062 "	0.0625 in	SOIC	20.32 mm	0.46 in	11.68 mm	0.8 "	0.05 in	1.27 mm
Aries Electronics 08-350000-11-RC	SMD to DIP	8	FR4 Epoxy Glass	1.57 mm	0.062 "	0.0625 in	SOIC	20.32 mm	0.46 in	11.68 mm	0.8 "	0.05 in	1.27 mm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly