08-3500 Series
Manufacturer: Aries Electronics
Beta
⌘K
SOCKET ADAPTER SOIC TO 8DIP 0.3
| Part | Proto Board Type | Number of Positions | Material | Board Thickness | Board Thickness | Board Thickness | Package Accepted | Size / Dimension [x] | Size / Dimension [y] | Size / Dimension [y] | Size / Dimension [x] | Pitch | Pitch | Mounting Type | Termination | Convert From (Adapter End) | Convert To (Adapter End) | Convert To (Adapter End) | Convert To (Adapter End) | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Number of Pins | Board Material | Pitch - Post | Pitch - Post | Contact Material - Post [custom] | Termination Post Length | Termination Post Length | Pitch - Mating | Pitch - Mating | Contact Finish - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | SMD to DIP | 8 | FR4 Epoxy Glass | 1.57 mm | 0.062 " | 0.0625 in | SOIC | 20.32 mm | 0.46 in | 11.68 mm | 0.8 " | 0.05 in | 1.27 mm | ||||||||||||||||||
 Aries Electronics | DIP to DIP | 8 | FR4 Epoxy Glass | 1.57 mm | 0.062 " | SOIC | 0.05 in | 1.27 mm | Through Hole | Solder | SOIC | 7.62 mm | DIP | 0.3 in | 200 µin | 5.08 µm | 8 | Polyimide (PI) | 0.1 in | 2.54 mm | Brass | 0.125 in | 3.18 mm | 1.27 mm | 0.05 in | Tin-Lead | |||||
 Aries Electronics | SMD to DIP | 8 | FR4 Epoxy Glass | 1.57 mm | 0.062 " | 0.0625 in | SOIC | 20.32 mm | 0.46 in | 11.68 mm | 0.8 " | 0.05 in | 1.27 mm | ||||||||||||||||||
 Aries Electronics | SMD to DIP | 8 | FR4 Epoxy Glass | 1.57 mm | 0.062 " | 0.0625 in | SOIC | 20.32 mm | 0.46 in | 11.68 mm | 0.8 " | 0.05 in | 1.27 mm | ||||||||||||||||||
Aries Electronics | SMD to DIP | 8 | FR4 Epoxy Glass | 1.57 mm | 0.062 " | 0.0625 in | SOIC | 20.32 mm | 0.46 in | 11.68 mm | 0.8 " | 0.05 in | 1.27 mm |