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49-WLCSP
Integrated Circuits (ICs)

ATSAMG55G19B-UNT

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Microchip Technology

WLCSP MRL B 105C TEMP T&R

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49-WLCSP
Integrated Circuits (ICs)

ATSAMG55G19B-UNT

Active
Microchip Technology

WLCSP MRL B 105C TEMP T&R

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationATSAMG55G19B-UNT
Core ProcessorARM® Cortex®-M4
Core Size32-Bit Single-Core
Data Converters [custom]12 b
Data Converters [custom]8
Mounting TypeSurface Mount
Operating Temperature [Max]105 °C
Operating Temperature [Min]-40 °C
Oscillator TypeInternal
Package / CaseWLCSP, 49-UFBGA
PeripheralsI2S, WDT, POR, DMA, PWM
Program Memory Size512 KB
Program Memory TypeFLASH
RAM Size176 K
Speed120 MHz
Supplier Device Package49-WLCSP (2.84x2.84)
Voltage - Supply (Vcc/Vdd) [Max]3.6 V
Voltage - Supply (Vcc/Vdd) [Min]1.62 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
Microchip DirectT/R 1$ 5.73
25$ 5.20
100$ 4.71
1000$ 4.29
5000$ 4.12

Description

General part information

ATSAMG55J19B Series

For new designs, please consider Revision B [ATSAMG55J19B](https://www.microchip.com/en-us/product/atsamg55g19b).

The Microchip's SAM G55 embeds a Cortex-M4 CPU with an FPU (floating point unit). This ensures maximum throughput. This is very important as it allows you to minimize the active power consumption and get to sleep faster in order to reduce the overall power consumption. Additionally, the devices have 30 DMA channels, which give extremely high throughput.

The combination of ultra-low power consumption, fast wake-up time and high throughput is what gives the SAM G the edge in space- and power-constrained consumer applications such as sensor hubs. It wakes up quickly, has the throughput needed to reduce the amount of time spent in active mode, and then goes back to sleep with SRAM retention to conserve energy.