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R6020ENZ4C13
Discrete Semiconductor Products

RGTH60TS65GC13

Active
Rohm Semiconductor

HIGH-SPEED SWITCHING TYPE, 650V 30A, TO-247N, FIELD STOP TRENCH IGBT

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R6020ENZ4C13
Discrete Semiconductor Products

RGTH60TS65GC13

Active
Rohm Semiconductor

HIGH-SPEED SWITCHING TYPE, 650V 30A, TO-247N, FIELD STOP TRENCH IGBT

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationRGTH60TS65GC13
Current - Collector (Ic) (Max) [Max]58 A
Current - Collector Pulsed (Icm)120 A
Gate Charge58 nC
IGBT TypeTrench Field Stop
Mounting TypeThrough Hole
Operating Temperature [Max]175 °C
Operating Temperature [Min]-40 C
Package / CaseTO-247-3
Power - Max [Max]194 W
Supplier Device PackageTO-247
Td (on/off) @ 25°C27 ns, 105 ns
Test Condition15 V, 400 V, 30 A, 10 Ohm
Vce(on) (Max) @ Vge, Ic2.1 V
Voltage - Collector Emitter Breakdown (Max)650 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTube 1$ 6.05
30$ 3.43
120$ 2.85
510$ 2.43
1020$ 2.34

Description

General part information

RGTH60TS65D Series

ROHM's IGBT products will contribute to energy saving high efficiency and a wide range of high voltage and high-current applications.

Documents

Technical documentation and resources

Anti-Whisker formation

Package Information

What Is Thermal Design

Thermal Design

About Export Administration Regulations (EAR)

Export Information

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

4 Steps for Successful Thermal Designing of Power Devices

White Paper

Two-Resistor Model for Thermal Simulation

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Moisture Sensitivity Level

Package Information

How to Create Symbols for PSpice Models

Models

The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level

White Paper

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Method for Monitoring Switching Waveform

Schematic Design & Verification

Types and Features of Transistors

Application Note

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Reliability Test Result

Manufacturing Data

About Flammability of Materials

Environmental Data

RGTH60TS65 Data Sheet

Data Sheet

Judgment Criteria of Thermal Evaluation

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Compliance of the ELV directive

Environmental Data

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Generation Mechanism of Voltage Surge on Commutation Side (Basic)

Technical Article

Semikron Danfoss: Partnering for the Safe Supply of Industrial Power Modules

White Paper