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8-PDIP
Integrated Circuits (ICs)

TC4423VPA

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Microchip Technology

DUAL 3 A MOSFET GATE DRIVER

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8-PDIP
Integrated Circuits (ICs)

TC4423VPA

Active
Microchip Technology

DUAL 3 A MOSFET GATE DRIVER

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationTC4423VPA
Channel TypeIndependent
Current - Peak Output (Source, Sink) [custom]3 A
Current - Peak Output (Source, Sink) [custom]3 A
Driven ConfigurationLow-Side
Gate TypeN-Channel, P-Channel MOSFET
Input TypeInverting
Mounting TypeThrough Hole
Number of Drivers2
Operating Temperature [Max]150 °C
Operating Temperature [Min]-40 °C
Package / Case0.3 in
Package / Case8-DIP
Package / Case7.62 mm
Rise / Fall Time (Typ) [custom]25 ns
Rise / Fall Time (Typ) [custom]23 ns
Supplier Device Package8-PDIP
Voltage - Supply [Max]18 V
Voltage - Supply [Min]4.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTube 1$ 4.17
Microchip DirectTUBE 1$ 4.17
25$ 3.47
100$ 3.16
1000$ 2.63
5000$ 2.44
10000$ 2.26

Description

General part information

TC4423A Series

The TC4423/4424/4425 are higher output current versions of the new TC4426/4427/4428 buffer/gate drivers which, in turn, are improved versions of the earlier TC426/427/428 series. All three families are pin-compatible. The TC4423/4424/4425 gate drivers are capable of giving reliable service in far more demanding electrical environments than their antecedents. Although primarily intended for driving power MOSFETs, the TC4423/4424/4425 gate drivers are equally well-suited to driving any other load (capacitive, resistive, or inductive) which requires a low impedance driver capable of high peak currents and fast switching times. For example, heavily loaded clock lines, coaxial cables, or piezoelectric transducers can all be driven from the TC4423/4424/4425. The only known limitation on loading is the total power dissipated in the driver must be kept within the maximum power dissipation limits of the package.