336-PLS20021-12

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IC & COMPONENT SOCKETS 336 PIN PGA GOLD

Active

IC & COMPONENT SOCKETS 336 PIN PGA GOLD

Description

General part information

Pos PGA, ZIF (ZIP) Socket Gold Through Hole

Parameters and characteristics for this part

Specification	336-PLS20021-12

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	30 µin
Contact Finish Thickness - Post	200 µin
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Current Rating	1 A
Features	Closed Frame
Housing Material	PPS, Polyphenylene Sulfide
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-65 °C
Pitch - Mating	0.1 in
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	0.125 in
Type	PGA, ZIF (ZIP)

Part	Current Rating	Material Flammability Rating	Termination Post Length	Contact Finish - Mating	Features	Contact Material - Post	Pitch - Post	Termination	Contact Finish - Post	Contact Finish Thickness - Mating	Housing Material	Pitch - Mating	Type	Contact Material - Mating	Mounting Type	Operating Temperature (Max)	Operating Temperature (Min)	Contact Finish Thickness - Post
Aries Electronics 336-PLS20021-12	1 A	UL94 V-0	0.125 in	Gold	Closed Frame	Beryllium Copper	0.1 in	Solder	Tin	30 µin	Polyphenylene Sulfide PPS	0.1 in	PGA ZIF (ZIP)	Beryllium Copper	Through Hole	125 °C	-65 °C	200 µin
Aries Electronics 144-PLS15026-12	1 A	UL94 V-0	0.125 in	Gold	Closed Frame	Beryllium Copper	0.1 in	Solder	Tin	30 µin	Polyphenylene Sulfide PPS	0.1 in	PGA ZIF (ZIP)	Beryllium Copper	Through Hole	125 °C	-65 °C	200 µin
Aries Electronics 120-PLS13015-12				Gold	Closed Frame	Beryllium Copper	0.1 in	Solder	Tin	30 µin	Polyphenylene Sulfide PPS	0.1 in	PGA ZIF (ZIP)	Beryllium Copper	Through Hole	125 °C	-65 °C	200 µin

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3D models and CAD resources for this part

Technical documentation and resources