PLS Series
Manufacturer: Aries Electronics
IC & COMPONENT SOCKETS 336 PIN PGA GOLD
| Part | Current Rating (Amps) | Material Flammability Rating | Termination Post Length | Termination Post Length | Contact Finish - Mating | Features | Contact Material - Post | Pitch - Post | Pitch - Post | Termination | Contact Finish - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Pitch - Mating | Pitch - Mating | Type | Contact Material - Mating | Mounting Type | Operating Temperature [Min] | Operating Temperature [Max] | Contact Finish Thickness - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 1 A | UL94 V-0 | 0.125 in | 3.18 mm | Gold | Closed Frame | Beryllium Copper | 0.1 in | 2.54 mm | Solder | Tin | 0.76 Ám | 30 Áin | 0.1 " | 2.54 mm | PGA ZIF (ZIP) | Beryllium Copper | Through Hole | -65 ░C | 125 °C | 200 µin | 5.08 µm |
Aries Electronics | 1 A | UL94 V-0 | 0.125 in | 3.18 mm | Gold | Closed Frame | Beryllium Copper | 0.1 in | 2.54 mm | Solder | Tin | 0.76 Ám | 30 Áin | 0.1 " | 2.54 mm | PGA ZIF (ZIP) | Beryllium Copper | Through Hole | -65 ░C | 125 °C | 200 µin | 5.08 µm |
Aries Electronics | Gold | Closed Frame | Beryllium Copper | 0.1 in | 2.54 mm | Solder | Tin | 0.76 Ám | 30 Áin | 0.1 " | 2.54 mm | PGA ZIF (ZIP) | Beryllium Copper | Through Hole | -65 ░C | 125 °C | 200 µin | 5.08 µm |