PLS Series
Manufacturer: Aries Electronics
Beta
⌘K
IC & COMPONENT SOCKETS 336 PIN PGA GOLD
| Part | Current Rating | Material Flammability Rating | Termination Post Length | Contact Finish - Mating | Features | Contact Material - Post | Pitch - Post | Termination | Contact Finish - Post | Contact Finish Thickness - Mating | Housing Material | Pitch - Mating | Type | Contact Material - Mating | Mounting Type | Operating Temperature (Max) | Operating Temperature (Min) | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 1 A | UL94 V-0 | 0.125 in | Gold | Closed Frame | Beryllium Copper | 0.1 in | Solder | Tin | 30 µin | Polyphenylene Sulfide PPS | 0.1 in | PGA ZIF (ZIP) | Beryllium Copper | Through Hole | 125 °C | -65 °C | 200 µin |
Aries Electronics | 1 A | UL94 V-0 | 0.125 in | Gold | Closed Frame | Beryllium Copper | 0.1 in | Solder | Tin | 30 µin | Polyphenylene Sulfide PPS | 0.1 in | PGA ZIF (ZIP) | Beryllium Copper | Through Hole | 125 °C | -65 °C | 200 µin |
Aries Electronics | Gold | Closed Frame | Beryllium Copper | 0.1 in | Solder | Tin | 30 µin | Polyphenylene Sulfide PPS | 0.1 in | PGA ZIF (ZIP) | Beryllium Copper | Through Hole | 125 °C | -65 °C | 200 µin |