Integrated Circuits (ICs)

W66CQ2NQUAGJ TR

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Winbond Electronics

IC DRAM 4GBIT LVSTL 11 200WFBGA

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Integrated Circuits (ICs)

Active

Winbond Electronics

IC DRAM 4GBIT LVSTL 11 200WFBGA

Technical Specifications

Parameters and characteristics for this part

Part	Voltage - Supply [Min]	Voltage - Supply [Max]	Memory Size	Package / Case	Memory Organization	Write Cycle Time - Word, Page	Supplier Device Package	Operating Temperature [Max]	Operating Temperature [Min]	Memory Type	Clock Frequency	Mounting Type	Technology	Memory Format	Access Time	Supplier Device Package [y]	Supplier Device Package [x]
Winbond Electronics W66CQ2NQUAGJ	1.06 V 1.7 V	1.17 V 1.95 V	512 kb	200-WFBGA	128 M	18 ns	200-WFBGA (10x14.5)	105 °C	-40 °C	Volatile	1866 MHz	Surface Mount	SDRAM - Mobile LPDDR4X	DRAM
Winbond Electronics W66CQ2NQUAHJ TR	1.06 V 1.7 V	1.17 V 1.95 V	512 kb	200-WFBGA	128 M	18 ns	200-WFBGA (10x14.5)	105 °C	-40 °C	Volatile	2.133 GHz	Surface Mount	SDRAM - Mobile LPDDR4X	DRAM
Winbond Electronics W66CQ2NQUAGJ TR	1.06 V 1.7 V	1.17 V 1.95 V	512 kb	200-WFBGA	128 M	18 ns	200-WFBGA (10x14.5)	105 °C	-40 °C	Volatile	1866 MHz	Surface Mount	SDRAM - Mobile LPDDR4X	DRAM
Winbond Electronics W66CQ2NQQAHJ	1.06 V 1.7 V	1.17 V 1.95 V	512 kb	200-TFBGA	128 M	18 ns	200-TFBGA	105 °C	-40 °C	Volatile	2.133 GHz	Surface Mount	SDRAM - Mobile LPDDR4X	DRAM	3.6 ns	14.5	10
Winbond Electronics W66CQ2NQUAFJ TR	1.06 V 1.7 V	1.17 V 1.95 V	512 kb	200-WFBGA	128 M	18 ns	200-WFBGA (10x14.5)	105 °C	-40 °C	Volatile	1.6 GHz	Surface Mount	SDRAM - Mobile LPDDR4X	DRAM

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tape & Reel (TR)	2500	$ 5.44

General part information

SDRAM - Mobile LPDDR4X Memory IC 4Gbit LVSTL_11 1.866 GHz 3.5 ns 200-WFBGA (10x14.5)

Technical documentation and resources