Zenode.ai Logo
Beta
200WFBGA
Integrated Circuits (ICs)

W66CQ2NQUAHJ

Active
Winbond Electronics

IC DRAM 4GBIT LVSTL 11 200WFBGA

Deep-Dive with AI

Search across all available documentation for this part.

200WFBGA
Integrated Circuits (ICs)

W66CQ2NQUAHJ

Active
Winbond Electronics

IC DRAM 4GBIT LVSTL 11 200WFBGA

Technical Specifications

Parameters and characteristics for this part

SpecificationW66CQ2NQUAHJ
Access Time3.5 ns
Clock Frequency2.133 GHz
Memory FormatDRAM
Memory InterfaceLVSTL_11
Memory Organization128 M
Memory Size512 kB
Memory TypeVolatile
Mounting TypeSurface Mount
Operating Temperature [Max]105 °C
Operating Temperature [Min]-40 °C
Package / Case200-WFBGA
Supplier Device Package200-WFBGA (10x14.5)
TechnologySDRAM - Mobile LPDDR4X
Voltage - Supply [Max]1.17 V, 1.95 V
Voltage - Supply [Min]1.7 V, 1.06 V
Write Cycle Time - Word, Page18 ns

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 0$ 9.54
Tray 144$ 5.32

Description

General part information

W66CQ2 Series

SDRAM - Mobile LPDDR4X Memory IC 4Gbit LVSTL_11 2.133 GHz 3.5 ns 200-WFBGA (10x14.5)