Connectors, Interconnects

40-6556-10

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Aries Electronics

IC & COMPONENT SOCKETS 40 SCKT RECEPT TIN SOLDER TAIL

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Connectors, Interconnects

40-6556-10

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Aries Electronics

IC & COMPONENT SOCKETS 40 SCKT RECEPT TIN SOLDER TAIL

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Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	40-6556-10

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	0.76 Ám
Contact Finish Thickness - Mating	30 Áin
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Current Rating (Amps)	3 A
Features	Open Frame
Housing Material	Polyphenylene Sulfide (PPS), Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	40
Pitch - Mating	0.1 "
Pitch - Mating	2.54 mm
Pitch - Post	0.1 in
Pitch - Post	2.54 mm
Termination	Solder
Termination Post Length	3.3 mm
Termination Post Length	0.13 in
Type	DIP
Type [custom]	15.24 mm
Type [custom]	0.6 in

40-6556 Series

Part	Current Rating (Amps)	Material Flammability Rating	Termination Post Length	Termination Post Length	Number of Positions or Pins (Grid)	Type [custom]	Type [custom]	Type	Housing Material	Pitch - Mating	Pitch - Mating	Contact Material - Post [custom]	Contact Finish - Post	Contact Finish - Mating	Mounting Type	Contact Material - Mating	Features	Pitch - Post	Pitch - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Termination	Operating Temperature
Aries Electronics 40-6556-41	3 A	UL94 V-0	0.18 in	4.57 mm	40	15.24 mm	0.6 in	DIP	Polyphenylene Sulfide (PPS) Glass Filled	0.1 "	2.54 mm	Brass	Gold	Gold	Through Hole	Beryllium Copper	Open Frame	0.1 in	2.54 mm	0.76 Ám	30 Áin	10 Áin	0.25 çm
Aries Electronics 40-6556-40	3 A	UL94 V-0	0.18 in	4.57 mm	40	15.24 mm	0.6 in	DIP	Polyphenylene Sulfide (PPS) Glass Filled	0.1 "	2.54 mm	Brass	Tin	Gold	Through Hole	Beryllium Copper	Open Frame	0.1 in	2.54 mm	0.76 Ám	30 Áin	200 µin	5.08 µm
Aries Electronics 40-6556-30	3 A	UL94 V-0	0.423 in	10.74 mm	40	15.24 mm	0.6 in	DIP	Polyphenylene Sulfide (PPS) Glass Filled	0.1 "	2.54 mm	Brass	Tin	Gold	Through Hole	Beryllium Copper	Open Frame	0.1 in	2.54 mm	0.76 Ám	30 Áin	200 µin	5.08 µm	Wire Wrap
Aries Electronics 40-6556-10	3 A	UL94 V-0	0.13 in	3.3 mm	40	15.24 mm	0.6 in	DIP	Polyphenylene Sulfide (PPS) Glass Filled	0.1 "	2.54 mm	Brass	Tin	Gold	Through Hole	Beryllium Copper	Open Frame	0.1 in	2.54 mm	0.76 Ám	30 Áin	200 µin	5.08 µm	Solder
Aries Electronics 40-6556-31	3 A	UL94 V-0	0.423 in	10.74 mm	40	15.24 mm	0.6 in	DIP	Polyphenylene Sulfide (PPS) Glass Filled	0.1 "	2.54 mm	Brass	Gold	Gold	Through Hole	Beryllium Copper	Open Frame	0.1 in	2.54 mm	0.76 Ám	30 Áin	10 Áin	0.25 çm	Wire Wrap	150 °C
Aries Electronics 40-6556-11	3 A	UL94 V-0	0.13 in	3.3 mm	40	15.24 mm	0.6 in	DIP	Polyphenylene Sulfide (PPS) Glass Filled	0.1 "	2.54 mm	Brass	Gold	Gold	Through Hole	Beryllium Copper	Open Frame	0.1 in	2.54 mm	0.76 Ám	30 Áin	10 Áin	0.25 çm	Solder

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	36	$ 13.18
	N/A	0	$ 13.32
Mouser	N/A	1	$ 13.92
		10	$ 12.94
		25	$ 12.47
		50	$ 12.07
		100	$ 11.36
		250	$ 10.80
		500	$ 10.47
		1000	$ 10.10

Description

General part information

40-6556 Series

40 (2 x 20) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources