40-6556 Series
Manufacturer: Aries Electronics
CONN IC DIP SOCKET 40POS GOLD
| Part | Current Rating (Amps) | Material Flammability Rating | Termination Post Length | Termination Post Length | Number of Positions or Pins (Grid) | Type [custom] | Type [custom] | Type | Housing Material | Pitch - Mating | Pitch - Mating | Contact Material - Post [custom] | Contact Finish - Post | Contact Finish - Mating | Mounting Type | Contact Material - Mating | Features | Pitch - Post | Pitch - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Termination | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 3 A | UL94 V-0 | 0.18 in | 4.57 mm | 40 | 15.24 mm | 0.6 in | DIP | Polyphenylene Sulfide (PPS) Glass Filled | 0.1 " | 2.54 mm | Brass | Gold | Gold | Through Hole | Beryllium Copper | Open Frame | 0.1 in | 2.54 mm | 0.76 Ám | 30 Áin | 10 Áin | 0.25 çm | ||
Aries Electronics | 3 A | UL94 V-0 | 0.18 in | 4.57 mm | 40 | 15.24 mm | 0.6 in | DIP | Polyphenylene Sulfide (PPS) Glass Filled | 0.1 " | 2.54 mm | Brass | Tin | Gold | Through Hole | Beryllium Copper | Open Frame | 0.1 in | 2.54 mm | 0.76 Ám | 30 Áin | 200 µin | 5.08 µm | ||
Aries Electronics | 3 A | UL94 V-0 | 0.423 in | 10.74 mm | 40 | 15.24 mm | 0.6 in | DIP | Polyphenylene Sulfide (PPS) Glass Filled | 0.1 " | 2.54 mm | Brass | Tin | Gold | Through Hole | Beryllium Copper | Open Frame | 0.1 in | 2.54 mm | 0.76 Ám | 30 Áin | 200 µin | 5.08 µm | Wire Wrap | |
Aries Electronics | 3 A | UL94 V-0 | 0.13 in | 3.3 mm | 40 | 15.24 mm | 0.6 in | DIP | Polyphenylene Sulfide (PPS) Glass Filled | 0.1 " | 2.54 mm | Brass | Tin | Gold | Through Hole | Beryllium Copper | Open Frame | 0.1 in | 2.54 mm | 0.76 Ám | 30 Áin | 200 µin | 5.08 µm | Solder | |
Aries Electronics | 3 A | UL94 V-0 | 0.423 in | 10.74 mm | 40 | 15.24 mm | 0.6 in | DIP | Polyphenylene Sulfide (PPS) Glass Filled | 0.1 " | 2.54 mm | Brass | Gold | Gold | Through Hole | Beryllium Copper | Open Frame | 0.1 in | 2.54 mm | 0.76 Ám | 30 Áin | 10 Áin | 0.25 çm | Wire Wrap | 150 °C |
Aries Electronics | 3 A | UL94 V-0 | 0.13 in | 3.3 mm | 40 | 15.24 mm | 0.6 in | DIP | Polyphenylene Sulfide (PPS) Glass Filled | 0.1 " | 2.54 mm | Brass | Gold | Gold | Through Hole | Beryllium Copper | Open Frame | 0.1 in | 2.54 mm | 0.76 Ám | 30 Áin | 10 Áin | 0.25 çm | Solder |