Integrated Circuits (ICs)

M2S090-FGG484I

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Microchip Technology

SMARTFUSION2 SOC FPGA, ARM CORTEX-M3, 86KLES 484 PBGA 23X23X2.44MM TRAY ROHS COMPLIANT: YES

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DocumentsProduct Change Notice EN

Integrated Circuits (ICs)

M2S090-FGG484I

Active

Microchip Technology

SMARTFUSION2 SOC FPGA, ARM CORTEX-M3, 86KLES 484 PBGA 23X23X2.44MM TRAY ROHS COMPLIANT: YES

Deep-Dive with AI

DocumentsProduct Change Notice EN

Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	M2S090-FGG484I

Architecture	MCU, FPGA
Connectivity	CANbus, USB, Ethernet, SPI, UART/USART, I2C
Core Processor	ARM® Cortex®-M3
Flash Size	512 KB
Number of I/O	267 I/O
Operating Temperature [Max]	100 °C
Operating Temperature [Min]	-40 C
Package / Case	484-BGA
Peripherals	DDR, PCIe, SERDES
Primary Attributes	FPGA - 90K Logic Modules
RAM Size	64 KB
Speed	166 MHz
Supplier Device Package	484-FPBGA (23x23)

M2S090TS Series

Low Density Devices with hard ARM Cortex-M3

Part	Number of I/O	Architecture	Operating Temperature [Min]	Operating Temperature [Max]	Connectivity	RAM Size	Primary Attributes	Peripherals	Core Processor	Supplier Device Package	Speed	Package / Case	Flash Size	Supplier Device Package [x]	Supplier Device Package [y]
Microchip Technology M2S090-FGG484	267 I/O	MCU FPGA	0 °C	85 °C	CANbus Ethernet I2C SPI UART/USART USB	64 KB	FPGA - 90K Logic Modules	DDR PCIe SERDES	ARM® Cortex®-M3	484-FPBGA (23x23)	166 MHz	484-BGA	512 KB
Microchip Technology M2S090-FGG484I	267 I/O	MCU FPGA	-40 C	100 °C	CANbus Ethernet I2C SPI UART/USART USB	64 KB	FPGA - 90K Logic Modules	DDR PCIe SERDES	ARM® Cortex®-M3	484-FPBGA (23x23)	166 MHz	484-BGA	512 KB
Microchip Technology M2S090T-1FGG484I	267 I/O	MCU FPGA	-40 C	100 °C	CANbus Ethernet I2C SPI UART/USART USB	64 KB	FPGA - 90K Logic Modules	DDR PCIe SERDES	ARM® Cortex®-M3	484-FPBGA (23x23)	166 MHz	484-BGA	512 KB
Microchip Technology M2S090TS-FGG676	425	MCU FPGA	0 °C	85 °C	CANbus Ethernet I2C SPI UART/USART USB	64 KB	FPGA - 90K Logic Modules	DDR PCIe SERDES	ARM® Cortex®-M3	676-FBGA (27x27)	166 MHz	676-BGA	512 KB
Microchip Technology M2S090T-FCS325I	180	MCU FPGA	-40 C	100 °C	CANbus Ethernet I2C SPI UART/USART USB	64 KB	FPGA - 90K Logic Modules	DDR PCIe SERDES	ARM® Cortex®-M3	325-FCBGA	166 MHz	325-TFBGA FCBGA	512 KB	11	13.5
Microchip Technology M2S090T-1FG676I	425	MCU FPGA	-40 C	100 °C	CANbus Ethernet I2C SPI UART/USART USB	64 KB	FPGA - 90K Logic Modules	DDR PCIe SERDES	ARM® Cortex®-M3	676-FBGA (27x27)	166 MHz	676-BGA	512 KB
Microchip Technology M2S090TS-1FGG484M	267 I/O	MCU FPGA	-55 °C	125 ¯C	CANbus Ethernet I2C SPI UART/USART USB	64 KB	FPGA - 90K Logic Modules	DDR PCIe SERDES	ARM® Cortex®-M3	484-FPBGA (23x23)	166 MHz	484-BGA	512 KB
Microchip Technology M2S090TS-FG676I	425	MCU FPGA	-40 C	100 °C	CANbus Ethernet I2C SPI UART/USART USB	64 KB	FPGA - 90K Logic Modules	DDR PCIe SERDES	ARM® Cortex®-M3	676-FBGA (27x27)	166 MHz	676-BGA	512 KB
Microchip Technology M2S090T-1FCS325I	180	MCU FPGA	-40 C	100 °C	CANbus Ethernet I2C SPI UART/USART USB	64 KB	FPGA - 90K Logic Modules	DDR PCIe SERDES	ARM® Cortex®-M3	325-FCBGA	166 MHz	325-TFBGA FCBGA	512 KB	11	13.5
Microchip Technology M2S090T-1FGG484M	267 I/O	MCU FPGA	-55 °C	125 ¯C	CANbus Ethernet I2C SPI UART/USART USB	64 KB	FPGA - 90K Logic Modules	DDR PCIe SERDES	ARM® Cortex®-M3	484-FPBGA (23x23)	166 MHz	484-BGA	512 KB

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tray	1	$ 262.11
Microchip Direct	TRAY	1	$ 262.11
		50	$ 258.32
		250	$ 251.04
		500	$ 244.16
		1000	$ 137.10
		5000	$ 124.64
Newark	Each	50	$ 258.32
		250	$ 251.04
		500	$ 244.16

Description

General part information

M2S090TS Series

These flash FPGA devices are ideal for general purpose functions such as Gigabit Ethernet or dual PCI Express control planes, bridging functions, input/output (I/O) expansion and conversion, video/image processing, system management and secure connectivity. Microchip FPGAs are used by customers in Communications, Industrial, Medical, Defense, and Aviation markets.

More Resources in Low Density Devices

• ARM Cortex-M3 Processor with embedded flash

Documents

Technical documentation and resources

Product Change Notice EN

Datasheet