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676 FBBGA
Integrated Circuits (ICs)

M2S090TS-FG676I

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Microchip Technology

SMARTFUSION2 SOC FPGA, ARM CORTEX-M3, 86KLES 676 PBGA 27X27X2.44MM TRAY ROHS COMPLIANT: YES

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676 FBBGA
Integrated Circuits (ICs)

M2S090TS-FG676I

Active
Microchip Technology

SMARTFUSION2 SOC FPGA, ARM CORTEX-M3, 86KLES 676 PBGA 27X27X2.44MM TRAY ROHS COMPLIANT: YES

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

SpecificationM2S090TS-FG676I
ArchitectureMCU, FPGA
ConnectivityCANbus, USB, Ethernet, SPI, UART/USART, I2C
Core ProcessorARM® Cortex®-M3
Flash Size512 KB
Number of I/O425
Operating Temperature [Max]100 °C
Operating Temperature [Min]-40 C
Package / Case676-BGA
PeripheralsDDR, PCIe, SERDES
Primary AttributesFPGA - 90K Logic Modules
RAM Size64 KB
Speed166 MHz
Supplier Device Package676-FBGA (27x27)

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTray 40$ 346.92
Microchip DirectTRAY 1$ 346.92
50$ 341.88
250$ 332.24
500$ 323.15
1000$ 181.46
5000$ 164.97
NewarkEach 1$ 346.92
50$ 341.88
250$ 332.24
500$ 323.15

Description

General part information

M2S090TS Series

These flash FPGA devices are ideal for general purpose functions such as Gigabit Ethernet or dual PCI Express control planes, bridging functions, input/output (I/O) expansion and conversion, video/image processing, system management and secure connectivity. Microchip FPGAs are used by customers in Communications, Industrial, Medical, Defense, and Aviation markets.

More Resources in Low Density Devices

• ARM Cortex-M3 Processor with embedded flash

Documents

Technical documentation and resources