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STM32H533CET6
Integrated Circuits (ICs)

STM32H533CET6

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STMicroelectronics

HIGH-PERFORMANCE, ARM CORTEX-M33, MCU WITH 512-KBYTE FLASH, 272-KBYTE RAM, 250 MHZ CPU

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STM32H533CET6
Integrated Circuits (ICs)

STM32H533CET6

Active
STMicroelectronics

HIGH-PERFORMANCE, ARM CORTEX-M33, MCU WITH 512-KBYTE FLASH, 272-KBYTE RAM, 250 MHZ CPU

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationSTM32H533CET6
ConnectivityIrDA, UART/USART, SPI, FIFO, SMBus, I2C, USB, CANbus, LINbus
Core ProcessorARM® Cortex®-M33
Core Size32-Bit
Data Converters10, 12 b, 10 b, 2 channels
Data ConvertersSAR, D/A, A/D
Mounting TypeSurface Mount
Number of I/O35
Operating Temperature [Max]85 C
Operating Temperature [Min]-40 ¯C
Oscillator TypeExternal, Internal
Package / Case48-LQFP
PeripheralsPOR, WDT, PWM, Brown-out Detect/Reset, DMA, I2S
Program Memory Size512 KB
Program Memory TypeFLASH
RAM Size272 K
Speed250 MHz
Supplier Device Package48-LQFP (7x7)
Voltage - Supply (Vcc/Vdd) [Max]3.6 V
Voltage - Supply (Vcc/Vdd) [Min]1.71 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 1300$ 5.19
NewarkEach 1$ 5.28
10$ 3.46
25$ 3.38
50$ 3.36
100$ 3.35

Description

General part information

STM32H533CE Series

The STM32H533xx devices are high-performance microcontrollers of the STM32H5 series, based on the high-performance Arm®Cortex®-M33 32-bit RISC core. They operate at a frequency of up to 250 MHz.

The Cortex®-M33 core features a single-precision floating-point unit (FPU), which supports all the Arm®single-precision data-processing instructions and all the data types. This core implements a full set of DSP (digital signal processing) instructions and a memory protection unit (MPU) that enhances the application security.

The devices embed high-speed memories (512 Kbytes of dual bank flash memory and 272 Kbytes of SRAM), a flexible external memory controller (FMC) for devices with packages of 100 pins and more, one OCTOSPI memory interface (at least one Quad-SPI available on all packages), and an extensive range of enhanced I/Os and peripherals connected to three APB buses, three AHB buses, and a 32-bit multi-AHB bus matrix.

Documents

Technical documentation and resources