Connectors, Interconnects

01-0518-11H

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CONN SOCKET SIP 1POS GOLD

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Connectors, Interconnects

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CONN SOCKET SIP 1POS GOLD

Technical Specifications

Parameters and characteristics for this part

Specification	01-0518-11H

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	0.25 µm
Contact Finish Thickness - Mating	10 µin
Contact Finish Thickness - Post	10 Áin
Contact Finish Thickness - Post	0.25 çm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Current Rating (Amps)	3 A
Features	Open Frame
Housing Material	Polyamide (PA46), Nylon 4/6, Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	1 (1 x 1)
Pitch - Mating	0.1 "
Pitch - Mating	2.54 mm
Pitch - Post	0.1 in
Pitch - Post	2.54 mm
Termination	Solder
Termination Post Length	0.125 in
Termination Post Length	3.18 mm
Type	SIP

Part	Termination Post Length	Termination Post Length	Material Flammability Rating	Current Rating (Amps)	Contact Material - Post [custom]	Termination	Contact Finish - Mating	Mounting Type	Pitch - Mating	Pitch - Mating	Contact Material - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid)	Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Pitch - Post	Pitch - Post	Housing Material	Features	Contact Finish - Post
Aries Electronics 01-0518-10	0.125 in	3.18 mm	UL94 V-0	3 A	Brass	Solder	Gold	Through Hole	0.1 "	2.54 mm	Beryllium Copper	0.25 µm	10 µin	1 (1 x 1)	SIP	200 µin	5.08 µm	0.1 in	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	Open Frame	Tin
Aries Electronics 01-0518-10T	0.125 in	3.18 mm	UL94 V-0	3 A	Brass	Solder	Gold	Through Hole	0.1 "	2.54 mm	Beryllium Copper	0.25 µm	10 µin	1 (1 x 1)	SIP	200 µin	5.08 µm	0.1 in	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	Open Frame	Tin
Aries Electronics 01-0518-11	0.125 in	3.18 mm	UL94 V-0	3 A	Brass	Solder	Gold	Through Hole	0.1 "	2.54 mm	Beryllium Copper	0.25 µm	10 µin	1 (1 x 1)	SIP	10 Áin	0.25 çm	0.1 in	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	Open Frame	Gold
Aries Electronics 01-0518-11H	0.125 in	3.18 mm	UL94 V-0	3 A	Brass	Solder	Gold	Through Hole	0.1 "	2.54 mm	Beryllium Copper	0.25 µm	10 µin	1 (1 x 1)	SIP	10 Áin	0.25 çm	0.1 in	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	Open Frame	Gold

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

1 (1 x 1) Pos SIP Socket Gold Through Hole

Technical documentation and resources