01-0518 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN SOCKET SIP 1POS GOLD
| Part | Termination Post Length | Termination Post Length | Material Flammability Rating | Current Rating (Amps) | Contact Material - Post [custom] | Termination | Contact Finish - Mating | Mounting Type | Pitch - Mating | Pitch - Mating | Contact Material - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Pitch - Post | Pitch - Post | Housing Material | Features | Contact Finish - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 0.125 in | 3.18 mm | UL94 V-0 | 3 A | Brass | Solder | Gold | Through Hole | 0.1 " | 2.54 mm | Beryllium Copper | 0.25 µm | 10 µin | 1 (1 x 1) | SIP | 200 µin | 5.08 µm | 0.1 in | 2.54 mm | Polyamide (PA46) Nylon 4/6 Glass Filled | Open Frame | Tin |
 Aries Electronics | 0.125 in | 3.18 mm | UL94 V-0 | 3 A | Brass | Solder | Gold | Through Hole | 0.1 " | 2.54 mm | Beryllium Copper | 0.25 µm | 10 µin | 1 (1 x 1) | SIP | 200 µin | 5.08 µm | 0.1 in | 2.54 mm | Polyamide (PA46) Nylon 4/6 Glass Filled | Open Frame | Tin |
Aries Electronics | 0.125 in | 3.18 mm | UL94 V-0 | 3 A | Brass | Solder | Gold | Through Hole | 0.1 " | 2.54 mm | Beryllium Copper | 0.25 µm | 10 µin | 1 (1 x 1) | SIP | 10 Áin | 0.25 çm | 0.1 in | 2.54 mm | Polyamide (PA46) Nylon 4/6 Glass Filled | Open Frame | Gold |
Aries Electronics | 0.125 in | 3.18 mm | UL94 V-0 | 3 A | Brass | Solder | Gold | Through Hole | 0.1 " | 2.54 mm | Beryllium Copper | 0.25 µm | 10 µin | 1 (1 x 1) | SIP | 10 Áin | 0.25 çm | 0.1 in | 2.54 mm | Polyamide (PA46) Nylon 4/6 Glass Filled | Open Frame | Gold |