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XG8W-xx34
Connectors, Interconnects

XG8W-2034

Active
Omron Electronics Inc-EMC Div

CONN HEADER R/A 20POS 2.54MM

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XG8W-xx34
Connectors, Interconnects

XG8W-2034

Active
Omron Electronics Inc-EMC Div

CONN HEADER R/A 20POS 2.54MM

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationXG8W-2034
Connector TypeHeader
Contact Finish - MatingGold
Contact Finish - PostGold
Contact Finish Thickness - Mating [custom]5.9 µin
Contact Finish Thickness - Mating [custom]0.15 µm
Contact Finish Thickness - Post0.15 µm
Contact Finish Thickness - Post5.9 µin
Contact Length - Mating6 mm
Contact Length - Mating0.236 in
Contact Length - Post0.118 in
Contact Length - Post3 mm
Contact MaterialNickel, Brass
Contact ShapeSquare
Contact TypeMale Pin
Current Rating (Amps)3 A
Fastening TypePush-Pull
Insulation ColorBlack
Insulation Height [custom]0.236 "
Insulation Height [custom]6 mm
Insulation MaterialPolybutylene Terephthalate (PBT), Glass Filled
Material Flammability RatingUL94 V-0
Mounting TypeThrough Hole, Right Angle
Number of Positions20
Number of Positions LoadedAll
Number of Rows [custom]2
Operating Temperature [Max]105 ░C
Operating Temperature [Min]-55 C
Pitch - Mating0.1 "
Pitch - Mating2.54 mm
Row Spacing - Mating [x]0.1 in
Row Spacing - Mating [x]2.54 mm
ShroudingUnshrouded
StyleCable, Board to Board
TerminationSolder
Voltage Rating300 VDC
PartContact Finish Thickness - PostContact Finish Thickness - PostRow Spacing - Mating [x]Row Spacing - Mating [x]Contact Finish Thickness - Mating [custom]Contact Finish Thickness - Mating [custom]Voltage RatingMounting TypeContact MaterialShroudingTerminationNumber of PositionsNumber of Positions LoadedOperating Temperature [Min]Operating Temperature [Max]Contact Finish - MatingInsulation MaterialContact Length - PostContact Length - PostFastening TypeContact ShapePitch - MatingPitch - MatingInsulation ColorContact Length - MatingContact Length - MatingContact Finish - PostStyleConnector TypeOverall Contact LengthOverall Contact LengthContact TypeMaterial Flammability RatingInsulation HeightInsulation HeightCurrent Rating (Amps)Number of Rows [custom]Insulation Height [custom]Insulation Height [custom]Contact Finish Thickness - Post [custom]Contact Finish Thickness - Post [custom]Number of Positions [custom]
XG8W-xx31
Omron Electronics Inc-EMC Div
0.15 µm
5.9 µin
0.1 in
2.54 mm
5.9 µin
0.15 µm
300 VDC
Through Hole
Brass
Nickel
Unshrouded
Solder
50
All
-55 C
105 ░C
Gold
Polybutylene Terephthalate (PBT)
Glass Filled
0.118 in
3 mm
Push-Pull
Square
0.1 "
2.54 mm
Black
6 mm
0.236 in
Gold
Board to Board
Cable
Header
0.453 in
11.5 mm
Male Pin
UL94 V-0
0.098 "
2.5 mm
3 A
2
XG8W-xx31
Omron Electronics Inc-EMC Div
0.15 µm
5.9 µin
0.1 in
2.54 mm
5.9 µin
0.15 µm
300 VDC
Through Hole
Brass
Nickel
Unshrouded
Solder
26
All
-55 C
105 ░C
Gold
Polybutylene Terephthalate (PBT)
Glass Filled
0.118 in
3 mm
Push-Pull
Square
0.1 "
2.54 mm
Black
6 mm
0.236 in
Gold
Board to Board
Cable
Header
0.453 in
11.5 mm
Male Pin
UL94 V-0
0.098 "
2.5 mm
3 A
2
XG8W-xx34
Omron Electronics Inc-EMC Div
0.15 µm
5.9 µin
0.1 in
2.54 mm
5.9 µin
0.15 µm
300 VDC
Right Angle
Through Hole
Brass
Nickel
Unshrouded
Solder
20
All
-55 C
105 ░C
Gold
Polybutylene Terephthalate (PBT)
Glass Filled
0.118 in
3 mm
Push-Pull
Square
0.1 "
2.54 mm
Black
6 mm
0.236 in
Gold
Board to Board
Cable
Header
Male Pin
UL94 V-0
3 A
2
0.236 "
6 mm
XG8W-1441
Omron Electronics Inc-EMC Div
0.1 in
2.54 mm
300 VDC
Through Hole
Brass
Nickel
Unshrouded
Solder
14
All
-55 C
105 ░C
Polybutylene Terephthalate (PBT)
Glass Filled
0.118 in
3 mm
Push-Pull
Square
0.1 "
2.54 mm
Black
6 mm
0.236 in
Tin
Board to Board
Cable
Header
0.453 in
11.5 mm
Male Pin
UL94 V-0
0.098 "
2.5 mm
3 A
2
78.7 µin
2 µm
XG8W-xx41
Omron Electronics Inc-EMC Div
0.1 in
2.54 mm
300 VDC
Through Hole
Brass
Nickel
Unshrouded
Solder
40
All
-55 C
105 ░C
Polybutylene Terephthalate (PBT)
Glass Filled
0.118 in
3 mm
Push-Pull
Square
0.1 "
2.54 mm
Black
6 mm
0.236 in
Tin
Board to Board
Cable
Header
0.453 in
11.5 mm
Male Pin
UL94 V-0
0.098 "
2.5 mm
3 A
2
78.7 µin
2 µm
XG8W-1031
Omron Electronics Inc-EMC Div
0.15 µm
5.9 µin
0.1 in
2.54 mm
5.9 µin
0.15 µm
300 VDC
Through Hole
Brass
Nickel
Unshrouded
Solder
10
All
-55 C
105 ░C
Gold
Polybutylene Terephthalate (PBT)
Glass Filled
0.118 in
3 mm
Push-Pull
Square
0.1 "
2.54 mm
Black
6 mm
0.236 in
Gold
Board to Board
Cable
Header
0.453 in
11.5 mm
Male Pin
UL94 V-0
0.098 "
2.5 mm
3 A
2
XG8W-xx31
Omron Electronics Inc-EMC Div
0.15 µm
5.9 µin
0.1 in
2.54 mm
5.9 µin
0.15 µm
300 VDC
Through Hole
Brass
Nickel
Unshrouded
Solder
All
-55 C
105 ░C
Gold
Polybutylene Terephthalate (PBT)
Glass Filled
0.118 in
3 mm
Push-Pull
Square
0.1 "
2.54 mm
Black
6 mm
0.236 in
Gold
Board to Board
Cable
Header
0.453 in
11.5 mm
Male Pin
UL94 V-0
0.098 "
2.5 mm
3 A
2
34

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 1$ 2.74
10$ 2.09
100$ 1.61
500$ 1.36
1000$ 1.26
5000$ 1.08
N/A 142$ 2.26

Description

General part information

XG8W Series

Connector Header Through Hole, Right Angle 20 position 0.100" (2.54mm)