Connectors, Interconnects

XG8W-5031

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Omron Electronics Inc-EMC Div

CONN HEADER VERT 50POS 2.54MM

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Connectors, Interconnects

XG8W-5031

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Omron Electronics Inc-EMC Div

CONN HEADER VERT 50POS 2.54MM

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Technical Specifications

Parameters and characteristics for this part

Specification	XG8W-5031

Connector Type	Header
Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating [custom]	5.9 µin
Contact Finish Thickness - Mating [custom]	0.15 µm
Contact Finish Thickness - Post	0.15 µm
Contact Finish Thickness - Post	5.9 µin
Contact Length - Mating	6 mm
Contact Length - Mating	0.236 in
Contact Length - Post	0.118 in
Contact Length - Post	3 mm
Contact Material	Nickel, Brass
Contact Shape	Square
Contact Type	Male Pin
Current Rating (Amps)	3 A
Fastening Type	Push-Pull
Insulation Color	Black
Insulation Height	0.098 "
Insulation Height	2.5 mm
Insulation Material	Polybutylene Terephthalate (PBT), Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions	50
Number of Positions Loaded	All
Number of Rows [custom]	2
Operating Temperature [Max]	105 ░C
Operating Temperature [Min]	-55 C
Overall Contact Length	0.453 in
Overall Contact Length	11.5 mm
Pitch - Mating	0.1 "
Pitch - Mating	2.54 mm
Row Spacing - Mating [x]	0.1 in
Row Spacing - Mating [x]	2.54 mm
Shrouding	Unshrouded
Style	Cable, Board to Board
Termination	Solder
Voltage Rating	300 VDC

XG8W Series

Part	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Row Spacing - Mating [x]	Row Spacing - Mating [x]	Contact Finish Thickness - Mating [custom]	Contact Finish Thickness - Mating [custom]	Voltage Rating	Mounting Type	Contact Material	Shrouding	Termination	Number of Positions	Number of Positions Loaded	Operating Temperature [Min]	Operating Temperature [Max]	Contact Finish - Mating	Insulation Material	Contact Length - Post	Contact Length - Post	Fastening Type	Contact Shape	Pitch - Mating	Pitch - Mating	Insulation Color	Contact Length - Mating	Contact Length - Mating	Contact Finish - Post	Style	Connector Type	Overall Contact Length	Overall Contact Length	Contact Type	Material Flammability Rating	Insulation Height	Insulation Height	Current Rating (Amps)	Number of Rows [custom]	Insulation Height [custom]	Insulation Height [custom]	Contact Finish Thickness - Post [custom]	Contact Finish Thickness - Post [custom]	Number of Positions [custom]
Omron Electronics Inc-EMC Div XG8W-5031	0.15 µm	5.9 µin	0.1 in	2.54 mm	5.9 µin	0.15 µm	300 VDC	Through Hole	Brass Nickel	Unshrouded	Solder	50	All	-55 C	105 ░C	Gold	Polybutylene Terephthalate (PBT) Glass Filled	0.118 in	3 mm	Push-Pull	Square	0.1 "	2.54 mm	Black	6 mm	0.236 in	Gold	Board to Board Cable	Header	0.453 in	11.5 mm	Male Pin	UL94 V-0	0.098 "	2.5 mm	3 A	2
Omron Electronics Inc-EMC Div XG8W-2631	0.15 µm	5.9 µin	0.1 in	2.54 mm	5.9 µin	0.15 µm	300 VDC	Through Hole	Brass Nickel	Unshrouded	Solder	26	All	-55 C	105 ░C	Gold	Polybutylene Terephthalate (PBT) Glass Filled	0.118 in	3 mm	Push-Pull	Square	0.1 "	2.54 mm	Black	6 mm	0.236 in	Gold	Board to Board Cable	Header	0.453 in	11.5 mm	Male Pin	UL94 V-0	0.098 "	2.5 mm	3 A	2
Omron Electronics Inc-EMC Div XG8W-2034	0.15 µm	5.9 µin	0.1 in	2.54 mm	5.9 µin	0.15 µm	300 VDC	Right Angle Through Hole	Brass Nickel	Unshrouded	Solder	20	All	-55 C	105 ░C	Gold	Polybutylene Terephthalate (PBT) Glass Filled	0.118 in	3 mm	Push-Pull	Square	0.1 "	2.54 mm	Black	6 mm	0.236 in	Gold	Board to Board Cable	Header			Male Pin	UL94 V-0			3 A	2	0.236 "	6 mm
Omron Electronics Inc-EMC Div XG8W-1441			0.1 in	2.54 mm			300 VDC	Through Hole	Brass Nickel	Unshrouded	Solder	14	All	-55 C	105 ░C		Polybutylene Terephthalate (PBT) Glass Filled	0.118 in	3 mm	Push-Pull	Square	0.1 "	2.54 mm	Black	6 mm	0.236 in	Tin	Board to Board Cable	Header	0.453 in	11.5 mm	Male Pin	UL94 V-0	0.098 "	2.5 mm	3 A	2			78.7 µin	2 µm
Omron Electronics Inc-EMC Div XG8W-4041			0.1 in	2.54 mm			300 VDC	Through Hole	Brass Nickel	Unshrouded	Solder	40	All	-55 C	105 ░C		Polybutylene Terephthalate (PBT) Glass Filled	0.118 in	3 mm	Push-Pull	Square	0.1 "	2.54 mm	Black	6 mm	0.236 in	Tin	Board to Board Cable	Header	0.453 in	11.5 mm	Male Pin	UL94 V-0	0.098 "	2.5 mm	3 A	2			78.7 µin	2 µm
Omron Electronics Inc-EMC Div XG8W-1031	0.15 µm	5.9 µin	0.1 in	2.54 mm	5.9 µin	0.15 µm	300 VDC	Through Hole	Brass Nickel	Unshrouded	Solder	10	All	-55 C	105 ░C	Gold	Polybutylene Terephthalate (PBT) Glass Filled	0.118 in	3 mm	Push-Pull	Square	0.1 "	2.54 mm	Black	6 mm	0.236 in	Gold	Board to Board Cable	Header	0.453 in	11.5 mm	Male Pin	UL94 V-0	0.098 "	2.5 mm	3 A	2
Omron Electronics Inc-EMC Div XG8W-3431	0.15 µm	5.9 µin	0.1 in	2.54 mm	5.9 µin	0.15 µm	300 VDC	Through Hole	Brass Nickel	Unshrouded	Solder		All	-55 C	105 ░C	Gold	Polybutylene Terephthalate (PBT) Glass Filled	0.118 in	3 mm	Push-Pull	Square	0.1 "	2.54 mm	Black	6 mm	0.236 in	Gold	Board to Board Cable	Header	0.453 in	11.5 mm	Male Pin	UL94 V-0	0.098 "	2.5 mm	3 A	2					34