XG8W Series

Manufacturer: Omron Electronics Inc-EMC Div

Catalog

CONN HEADER VERT 50POS 2.54MM

Part	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Row Spacing - Mating [x]	Row Spacing - Mating [x]	Contact Finish Thickness - Mating [custom]	Contact Finish Thickness - Mating [custom]	Voltage Rating	Mounting Type	Contact Material	Shrouding	Termination	Number of Positions	Number of Positions Loaded	Operating Temperature [Min]	Operating Temperature [Max]	Contact Finish - Mating	Insulation Material	Contact Length - Post	Contact Length - Post	Fastening Type	Contact Shape	Pitch - Mating	Pitch - Mating	Insulation Color	Contact Length - Mating	Contact Length - Mating	Contact Finish - Post	Style	Connector Type	Overall Contact Length	Overall Contact Length	Contact Type	Material Flammability Rating	Insulation Height	Insulation Height	Current Rating (Amps)	Number of Rows [custom]	Insulation Height [custom]	Insulation Height [custom]	Contact Finish Thickness - Post [custom]	Contact Finish Thickness - Post [custom]	Number of Positions [custom]
Omron Electronics Inc-EMC Div XG8W-5031	0.15 µm	5.9 µin	0.1 in	2.54 mm	5.9 µin	0.15 µm	300 VDC	Through Hole	Brass Nickel	Unshrouded	Solder	50	All	-55 C	105 ░C	Gold	Polybutylene Terephthalate (PBT) Glass Filled	0.118 in	3 mm	Push-Pull	Square	0.1 "	2.54 mm	Black	6 mm	0.236 in	Gold	Board to Board Cable	Header	0.453 in	11.5 mm	Male Pin	UL94 V-0	0.098 "	2.5 mm	3 A	2
Omron Electronics Inc-EMC Div XG8W-2631	0.15 µm	5.9 µin	0.1 in	2.54 mm	5.9 µin	0.15 µm	300 VDC	Through Hole	Brass Nickel	Unshrouded	Solder	26	All	-55 C	105 ░C	Gold	Polybutylene Terephthalate (PBT) Glass Filled	0.118 in	3 mm	Push-Pull	Square	0.1 "	2.54 mm	Black	6 mm	0.236 in	Gold	Board to Board Cable	Header	0.453 in	11.5 mm	Male Pin	UL94 V-0	0.098 "	2.5 mm	3 A	2
Omron Electronics Inc-EMC Div XG8W-2034	0.15 µm	5.9 µin	0.1 in	2.54 mm	5.9 µin	0.15 µm	300 VDC	Right Angle Through Hole	Brass Nickel	Unshrouded	Solder	20	All	-55 C	105 ░C	Gold	Polybutylene Terephthalate (PBT) Glass Filled	0.118 in	3 mm	Push-Pull	Square	0.1 "	2.54 mm	Black	6 mm	0.236 in	Gold	Board to Board Cable	Header			Male Pin	UL94 V-0			3 A	2	0.236 "	6 mm
Omron Electronics Inc-EMC Div XG8W-1441			0.1 in	2.54 mm			300 VDC	Through Hole	Brass Nickel	Unshrouded	Solder	14	All	-55 C	105 ░C		Polybutylene Terephthalate (PBT) Glass Filled	0.118 in	3 mm	Push-Pull	Square	0.1 "	2.54 mm	Black	6 mm	0.236 in	Tin	Board to Board Cable	Header	0.453 in	11.5 mm	Male Pin	UL94 V-0	0.098 "	2.5 mm	3 A	2			78.7 µin	2 µm
Omron Electronics Inc-EMC Div XG8W-4041			0.1 in	2.54 mm			300 VDC	Through Hole	Brass Nickel	Unshrouded	Solder	40	All	-55 C	105 ░C		Polybutylene Terephthalate (PBT) Glass Filled	0.118 in	3 mm	Push-Pull	Square	0.1 "	2.54 mm	Black	6 mm	0.236 in	Tin	Board to Board Cable	Header	0.453 in	11.5 mm	Male Pin	UL94 V-0	0.098 "	2.5 mm	3 A	2			78.7 µin	2 µm
Omron Electronics Inc-EMC Div XG8W-1031	0.15 µm	5.9 µin	0.1 in	2.54 mm	5.9 µin	0.15 µm	300 VDC	Through Hole	Brass Nickel	Unshrouded	Solder	10	All	-55 C	105 ░C	Gold	Polybutylene Terephthalate (PBT) Glass Filled	0.118 in	3 mm	Push-Pull	Square	0.1 "	2.54 mm	Black	6 mm	0.236 in	Gold	Board to Board Cable	Header	0.453 in	11.5 mm	Male Pin	UL94 V-0	0.098 "	2.5 mm	3 A	2
Omron Electronics Inc-EMC Div XG8W-3431	0.15 µm	5.9 µin	0.1 in	2.54 mm	5.9 µin	0.15 µm	300 VDC	Through Hole	Brass Nickel	Unshrouded	Solder		All	-55 C	105 ░C	Gold	Polybutylene Terephthalate (PBT) Glass Filled	0.118 in	3 mm	Push-Pull	Square	0.1 "	2.54 mm	Black	6 mm	0.236 in	Gold	Board to Board Cable	Header	0.453 in	11.5 mm	Male Pin	UL94 V-0	0.098 "	2.5 mm	3 A	2					34