Connectors, Interconnects

BM56G-10DP-0.35V(51)

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CONN HDR 0.35MM 10POS SMT GOLD

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Connectors, Interconnects

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CONN HDR 0.35MM 10POS SMT GOLD

Technical Specifications

Parameters and characteristics for this part

Specification	BM56G-10DP-0.35V(51)

Connector Type	Header, Outer Shroud Contacts
Contact Finish	Gold
Contact Finish Thickness	1.18 Áin
Contact Finish Thickness	0.03 Ám
Features	Solder Retention
Height Above Board [z]	0.46 mm
Height Above Board [z]	0.018 "
Mated Stacking Heights	0.6 mm
Mounting Type	Surface Mount
Number of Positions	10
Number of Rows [custom]	2
Pitch	0.014 in
Pitch	0.35 mm

Part	Mounting Type	Height Above Board [z]	Height Above Board [z]	Number of Positions	Contact Finish	Number of Rows [custom]	Pitch	Pitch	Connector Type	Contact Finish Thickness	Contact Finish Thickness	Features	Mated Stacking Heights
Hirose Electric Co Ltd BM56G-10DS-0.35V(53)	Surface Mount	0.02 in	0.5 mm	10	Gold	2	0.014 in	0.35 mm	Receptacle Center Strip Contacts
Hirose Electric Co Ltd BM56G-10DP-0.35V(53)	Surface Mount	0.018 "	0.46 mm	10	Gold	2	0.014 in	0.35 mm	Header Outer Shroud Contacts
Hirose Electric Co Ltd BM56G-10DS-0.35V(51)	Surface Mount	0.018 "	0.46 mm	10	Gold	2	0.014 in	0.35 mm	Receptacle Center Strip Contacts	1.18 Áin	0.03 Ám	Solder Retention	0.6 mm
Hirose Electric Co Ltd BM56G-10DP-0.35V(51)	Surface Mount	0.018 "	0.46 mm	10	Gold	2	0.014 in	0.35 mm	Header Outer Shroud Contacts	1.18 Áin	0.03 Ám	Solder Retention	0.6 mm

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General part information

10 Position Connector Header, Outer Shroud Contacts Surface Mount Gold

Technical documentation and resources