Connectors, Interconnects

BM56G-10DS-0.35V(51)

Active

CONN RCPT 0.35MM 10POS SMT GOLD

Search across all available documentation for this part.

Connectors, Interconnects

Active

CONN RCPT 0.35MM 10POS SMT GOLD

Technical Specifications

Parameters and characteristics for this part

Specification	BM56G-10DS-0.35V(51)

Connector Type	Receptacle, Center Strip Contacts
Contact Finish	Gold
Contact Finish Thickness	1.18 Áin
Contact Finish Thickness	0.03 Ám
Features	Solder Retention
Height Above Board [z]	0.46 mm
Height Above Board [z]	0.018 "
Mated Stacking Heights	0.6 mm
Mounting Type	Surface Mount
Number of Positions	10
Number of Rows [custom]	2
Pitch	0.014 in
Pitch	0.35 mm

Part	Mounting Type	Height Above Board [z]	Height Above Board [z]	Number of Positions	Contact Finish	Number of Rows [custom]	Pitch	Pitch	Connector Type	Contact Finish Thickness	Contact Finish Thickness	Features	Mated Stacking Heights
Hirose Electric Co Ltd BM56G-10DS-0.35V(53)	Surface Mount	0.02 in	0.5 mm	10	Gold	2	0.014 in	0.35 mm	Receptacle Center Strip Contacts
Hirose Electric Co Ltd BM56G-10DP-0.35V(53)	Surface Mount	0.018 "	0.46 mm	10	Gold	2	0.014 in	0.35 mm	Header Outer Shroud Contacts
Hirose Electric Co Ltd BM56G-10DS-0.35V(51)	Surface Mount	0.018 "	0.46 mm	10	Gold	2	0.014 in	0.35 mm	Receptacle Center Strip Contacts	1.18 Áin	0.03 Ám	Solder Retention	0.6 mm
Hirose Electric Co Ltd BM56G-10DP-0.35V(51)	Surface Mount	0.018 "	0.46 mm	10	Gold	2	0.014 in	0.35 mm	Header Outer Shroud Contacts	1.18 Áin	0.03 Ám	Solder Retention	0.6 mm

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

10 Position Connector Receptacle, Center Strip Contacts Surface Mount Gold

Technical documentation and resources