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Discrete Semiconductor Products

BSM400D12P3G002

Active
Rohm Semiconductor

SILICON CARBIDE MOSFET, HALF BRIDGE, DUAL N CHANNEL, 400 A, 1.2 KV, MODULE

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Product dimension image
Discrete Semiconductor Products

BSM400D12P3G002

Active
Rohm Semiconductor

SILICON CARBIDE MOSFET, HALF BRIDGE, DUAL N CHANNEL, 400 A, 1.2 KV, MODULE

Technical Specifications

Parameters and characteristics for this part

SpecificationBSM400D12P3G002
Configuration2 N-Channel (Half Bridge)
Current - Continuous Drain (Id) @ 25°C400 A
Drain to Source Voltage (Vdss)1200 V
Drain to Source Voltage (Vdss)1.2 kV
Input Capacitance (Ciss) (Max) @ Vds17000 pF
Mounting TypeChassis Mount
Operating Temperature [Max]150 °C
Operating Temperature [Min]-40 °C
Package / CaseModule
Power - Max [Max]1570 W
Supplier Device PackageModule
TechnologySilicon Carbide (SiC)
Vgs(th) (Max) @ Id5.6 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 1$ 1245.00
NewarkEach 1$ 1294.80

Description

General part information

BSM400D12P3G002 Series

BSM400D12P3G002 is a half bridge module consisting of SiC-UMOSFET and SiC-SBD, suitable for motor drive, inverter, converter, photovoltaics, wind power generation, induction heating equipment.

Documents

Technical documentation and resources

Judgment Criteria of Thermal Evaluation

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

How to Create Symbols for PSpice Models

Models

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Cutting-Edge Web Simulation Tool "ROHM Solution Simulator" Capable of Complete Circuit Verification of Power Devices and Driver ICs

White Paper

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Compliance of the ELV directive

Environmental Data

Simulation Verification to Identify Oscillation between Parallel Dies during Design Phase of Power Modules

Technical Article

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

What Is Thermal Design

Thermal Design

4 Steps for Successful Thermal Designing of Power Devices

White Paper

Method for Monitoring Switching Waveform

Schematic Design & Verification

PCB Layout Thermal Design Guide

Thermal Design

How to Use PLECS Models

Technical Article

How to measure the oscillation occurs between parallel-connected devices

Technical Article

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

About Export Regulations

Export Information

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Evaluation Board User's Guide

User's Guide

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

Thermal Resistance Measurement Method for SiC MOSFET

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Optimized heat sink assembly method for effective heat dissipation

Thermal Design