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ROHM BSM400D12P2G003
Discrete Semiconductor Products

BSM400D12P3G002

Active
Rohm Semiconductor

SILICON CARBIDE MOSFET, HALF BRIDGE, DUAL N CHANNEL, 400 A, 1.2 KV, MODULE

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ROHM BSM400D12P2G003
Discrete Semiconductor Products

BSM400D12P3G002

Active
Rohm Semiconductor

SILICON CARBIDE MOSFET, HALF BRIDGE, DUAL N CHANNEL, 400 A, 1.2 KV, MODULE

Technical Specifications

Parameters and characteristics for this part

SpecificationBSM400D12P3G002
Configuration2 N-Channel
Current - Continuous Drain (Id) @ 25°C400 A
Drain to Source Voltage (Vdss)1.2 kV
Drain to Source Voltage (Vdss)1200 V
Input Capacitance (Ciss) (Max) @ Vds [Max]17000 pF
Mounting TypeChassis Mount
Operating Temperature [Max]150 °C
Operating Temperature [Min]-40 °C
Package / CaseModule
Power - Max1570 W
Supplier Device PackageModule
TechnologySilicon Carbide (SiC)
Vgs(th) (Max) @ Id5.6 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 1$ 1245.00
N/A 2$ 1245.00
NewarkEach 1$ 1294.80

Description

General part information

BSM400 Series

BSM400D12P3G002 is a half bridge module consisting of SiC-UMOSFET and SiC-SBD, suitable for motor drive, inverter, converter, photovoltaics, wind power generation, induction heating equipment.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Product Change Notice EN

Datasheet

Oscillation countermeasures for MOSFETs in parallel

Schematic Design & Verification

Judgment Criteria of Thermal Evaluation

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

How to measure the oscillation occurs between parallel-connected devices

Technical Article

How to Create Symbols for PSpice Models

Models

Thermal Resistance Measurement Method for SiC MOSFET

Thermal Design

How to Use LTspice® Models

Schematic Design & Verification

Optimized heat sink assembly method for effective heat dissipation

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Compliance of the ELV directive

Environmental Data

Application Note for SiC Power Devices and Modules

Schematic Design & Verification

4 Steps for Successful Thermal Designing of Power Devices

White Paper

How to Use Thermal Models

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

About Export Regulations

Export Information

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Evaluation Board User's Guide

User's Guide

How to Use PSIM Models

Schematic Design & Verification

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Notes on Gate Drive Voltage Setting and Linear Mode Application of SiC MOSFET

Technical Article

Method for Monitoring Switching Waveform

Schematic Design & Verification

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

How to Use PLECS Models

Technical Article

Cutting-Edge Web Simulation Tool "ROHM Solution Simulator" Capable of Complete Circuit Verification of Power Devices and Driver ICs

White Paper

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

What is a Thermal Model? (SiC Power Device)

Thermal Design

What Is Thermal Design

Thermal Design

How to Suppress the Parallel Drive Oscillation in SiC Modules

Application Note

Part Explanation

Application Note

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Simulation Verification to Identify Oscillation between Parallel Dies during Design Phase of Power Modules

Technical Article

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design