Connectors, Interconnects

16-3518-101H

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Aries Electronics

IC & COMPONENT SOCKETS OPEN FRAME CAPACITOR COLLET SCKT

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Connectors, Interconnects

16-3518-101H

Active

Aries Electronics

IC & COMPONENT SOCKETS OPEN FRAME CAPACITOR COLLET SCKT

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Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	16-3518-101H

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	0.25 µm
Contact Finish Thickness - Mating	10 µin
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Current Rating (Amps)	3 A
Features	Open Frame
Housing Material	Polyamide (PA46), Nylon 4/6, Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	16
Number of Positions or Pins (Grid) [custom]	2
Number of Positions or Pins (Grid) [custom]	8
Pitch - Mating	0.1 "
Pitch - Mating	2.54 mm
Pitch - Post	0.1 in
Pitch - Post	2.54 mm
Termination	Solder
Termination Post Length	0.125 in
Termination Post Length	3.18 mm
Type	7.62 mm
Type	0.3 in
Type	DIP

16-3518 Series

Part	Material Flammability Rating	Termination Post Length	Termination Post Length	Current Rating (Amps)	Features	Mounting Type	Housing Material	Termination	Pitch - Mating	Pitch - Mating	Contact Finish - Post	Type	Type	Type	Pitch - Post	Pitch - Post	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Contact Material - Post [custom]
Aries Electronics 16-3518-10M	UL94 V-0	0.125 in	3.18 mm	3 A	Open Frame	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	Solder	0.1 "	2.54 mm	Tin	7.62 mm	0.3 in	DIP	0.1 in	2.54 mm	Gold	0.25 µm	10 µin	Beryllium Copper	200 µin	5.08 µm	2	16	8	Brass
Aries Electronics 16-3518-111	UL94 V-0	0.125 in	3.18 mm	3 A	Open Frame	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	Solder	0.1 "	2.54 mm	Gold	7.62 mm	0.3 in	DIP	0.1 in	2.54 mm	Gold	0.25 µm	10 µin	Beryllium Copper	10 Áin	0.25 çm	2	16	8	Brass
Aries Electronics 16-3518-10	UL94 V-0	0.125 in	3.18 mm	3 A	Open Frame	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	Solder	0.1 "	2.54 mm	Tin	7.62 mm	0.3 in	DIP	0.1 in	2.54 mm	Gold	0.25 µm	10 µin	Beryllium Copper	200 µin	5.08 µm	2	16	8	Brass
Aries Electronics 16-3518-101	UL94 V-0	0.125 in	3.18 mm	3 A	Open Frame	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	Solder	0.1 "	2.54 mm	Tin	7.62 mm	0.3 in	DIP	0.1 in	2.54 mm	Gold	0.25 µm	10 µin	Beryllium Copper	200 µin	5.08 µm	2	16	8	Brass
Aries Electronics 16-3518-11	UL94 V-0	0.125 in	3.18 mm	3 A	Open Frame	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	Solder	0.1 "	2.54 mm	Gold	7.62 mm	0.3 in	DIP	0.1 in	2.54 mm	Gold	0.25 µm	10 µin	Beryllium Copper	10 Áin	0.25 çm	2	16	8	Brass
Aries Electronics 16-3518-102	UL94 V-0	0.125 in	3.18 mm	3 A	Open Frame	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	Solder	0.1 "	2.54 mm	Tin	7.62 mm	0.3 in	DIP	0.1 in	2.54 mm	Gold	0.25 µm	10 µin	Beryllium Copper	200 µin	5.08 µm	2	16	8	Brass
Aries Electronics 16-3518-10H	UL94 V-0	0.125 in	3.18 mm	3 A	Open Frame	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	Solder	0.1 "	2.54 mm	Tin	7.62 mm	0.3 in	DIP	0.1 in	2.54 mm	Gold	0.25 µm	10 µin	Beryllium Copper	200 µin	5.08 µm	2	16	8	Brass
Aries Electronics 16-3518-101H	UL94 V-0	0.125 in	3.18 mm	3 A	Open Frame	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	Solder	0.1 "	2.54 mm	Tin	7.62 mm	0.3 in	DIP	0.1 in	2.54 mm	Gold	0.25 µm	10 µin	Beryllium Copper	200 µin	5.08 µm	2	16	8	Brass
Aries Electronics 16-3518-112	UL94 V-0	0.125 in	3.18 mm	3 A	Open Frame	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	Solder	0.1 "	2.54 mm	Gold	7.62 mm	0.3 in	DIP	0.1 in	2.54 mm	Gold	0.25 µm	10 µin	Beryllium Copper	10 Áin	0.25 çm	2	16	8	Brass
Aries Electronics 16-3518-01	UL94 V-0	0.125 in	3.18 mm	3 A	Open Frame	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	Solder	0.1 "	2.54 mm	Gold	7.62 mm	0.3 in	DIP	0.1 in	2.54 mm	Gold	0.25 µm	10 µin	Beryllium Copper	10 Áin	0.25 çm	2	16	8	Brass

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	123	$ 4.12
	N/A	0	$ 4.56
Mouser	N/A	1	$ 5.01
		10	$ 4.72
		25	$ 4.56
		50	$ 4.17
		100	$ 3.04
		2500	$ 2.97

Description

General part information

16-3518 Series

16 (2 x 8) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources