16-3518 Series

Catalog

CONN IC DIP SOCKET 16POS GOLD

Part	Material Flammability Rating	Termination Post Length	Termination Post Length	Current Rating (Amps)	Features	Mounting Type	Housing Material	Termination	Pitch - Mating	Pitch - Mating	Contact Finish - Post	Type	Type	Type	Pitch - Post	Pitch - Post	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Contact Material - Post [custom]
Aries Electronics 16-3518-10M	UL94 V-0	0.125 in	3.18 mm	3 A	Open Frame	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	Solder	0.1 "	2.54 mm	Tin	7.62 mm	0.3 in	DIP	0.1 in	2.54 mm	Gold	0.25 µm	10 µin	Beryllium Copper	200 µin	5.08 µm	2	16	8	Brass
Aries Electronics 16-3518-111	UL94 V-0	0.125 in	3.18 mm	3 A	Open Frame	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	Solder	0.1 "	2.54 mm	Gold	7.62 mm	0.3 in	DIP	0.1 in	2.54 mm	Gold	0.25 µm	10 µin	Beryllium Copper	10 Áin	0.25 çm	2	16	8	Brass
Aries Electronics 16-3518-10	UL94 V-0	0.125 in	3.18 mm	3 A	Open Frame	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	Solder	0.1 "	2.54 mm	Tin	7.62 mm	0.3 in	DIP	0.1 in	2.54 mm	Gold	0.25 µm	10 µin	Beryllium Copper	200 µin	5.08 µm	2	16	8	Brass
Aries Electronics 16-3518-101	UL94 V-0	0.125 in	3.18 mm	3 A	Open Frame	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	Solder	0.1 "	2.54 mm	Tin	7.62 mm	0.3 in	DIP	0.1 in	2.54 mm	Gold	0.25 µm	10 µin	Beryllium Copper	200 µin	5.08 µm	2	16	8	Brass
Aries Electronics 16-3518-11	UL94 V-0	0.125 in	3.18 mm	3 A	Open Frame	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	Solder	0.1 "	2.54 mm	Gold	7.62 mm	0.3 in	DIP	0.1 in	2.54 mm	Gold	0.25 µm	10 µin	Beryllium Copper	10 Áin	0.25 çm	2	16	8	Brass
Aries Electronics 16-3518-102	UL94 V-0	0.125 in	3.18 mm	3 A	Open Frame	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	Solder	0.1 "	2.54 mm	Tin	7.62 mm	0.3 in	DIP	0.1 in	2.54 mm	Gold	0.25 µm	10 µin	Beryllium Copper	200 µin	5.08 µm	2	16	8	Brass
Aries Electronics 16-3518-10H	UL94 V-0	0.125 in	3.18 mm	3 A	Open Frame	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	Solder	0.1 "	2.54 mm	Tin	7.62 mm	0.3 in	DIP	0.1 in	2.54 mm	Gold	0.25 µm	10 µin	Beryllium Copper	200 µin	5.08 µm	2	16	8	Brass
Aries Electronics 16-3518-101H	UL94 V-0	0.125 in	3.18 mm	3 A	Open Frame	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	Solder	0.1 "	2.54 mm	Tin	7.62 mm	0.3 in	DIP	0.1 in	2.54 mm	Gold	0.25 µm	10 µin	Beryllium Copper	200 µin	5.08 µm	2	16	8	Brass
Aries Electronics 16-3518-112	UL94 V-0	0.125 in	3.18 mm	3 A	Open Frame	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	Solder	0.1 "	2.54 mm	Gold	7.62 mm	0.3 in	DIP	0.1 in	2.54 mm	Gold	0.25 µm	10 µin	Beryllium Copper	10 Áin	0.25 çm	2	16	8	Brass
Aries Electronics 16-3518-01	UL94 V-0	0.125 in	3.18 mm	3 A	Open Frame	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	Solder	0.1 "	2.54 mm	Gold	7.62 mm	0.3 in	DIP	0.1 in	2.54 mm	Gold	0.25 µm	10 µin	Beryllium Copper	10 Áin	0.25 çm	2	16	8	Brass