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456 BBGA
Integrated Circuits (ICs)

APA600-BG456

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Microchip Technology

ULTRA LOW DENSITY FPGAS

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Search across all available documentation for this part.

456 BBGA
Integrated Circuits (ICs)

APA600-BG456

Active
Microchip Technology

ULTRA LOW DENSITY FPGAS

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationAPA600-BG456
Mounting TypeSurface Mount
Number of Gates600000
Number of I/O356
Operating Temperature [Max]70 °C
Operating Temperature [Min]0 °C
Package / Case456-BBGA
Total RAM Bits129024
Voltage - Supply [Max]2.7 V
Voltage - Supply [Min]2.3 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTray 24$ 785.70
Microchip DirectTRAY 1$ 785.69
50$ 774.92
250$ 754.28
500$ 725.26
1000$ 448.97
5000$ 428.57

Description

General part information

APA600 Series

The

ProASICPLUS family of devices, combines the advantages of ASICs with the

benefits of programmable devices through nonvolatile flash technology.

Documents

Technical documentation and resources

No documents available