APA600 Series

Ultra Low Density FPGAs

Catalog

Ultra Low Density FPGAs

Part	Package / Case	Operating Temperature [Max]	Operating Temperature [Min]	Mounting Type	Number of I/O	Total RAM Bits	Voltage - Supply [Max]	Voltage - Supply [Min]	Number of Gates	Supplier Device Package
Microchip Technology APA600-BGG456	456-BBGA	70 °C	0 °C	Surface Mount	356	129024	2.7 V	2.3 V	600000
Microchip Technology APA600-BG456	456-BBGA	70 °C	0 °C	Surface Mount	356	129024	2.7 V	2.3 V	600000
Microchip Technology APA600-FGG256M	256-LBGA	125 °C	-55 °C	Surface Mount	186	129024	2.7 V	2.3 V	600000	256-FPBGA (17x17)
Microchip Technology APA600-PQ208I	208-BFQFP	85 °C	-40 °C	Surface Mount	158	129024	2.7 V	2.3 V	600000	208-PQFP (28x28)
Microchip Technology APA600-FG484	484-BGA	70 °C	0 °C	Surface Mount	370	129024	2.7 V	2.3 V	600000	484-FPBGA (23x23)
Microchip Technology APA600-CQ208B	208-BFCQFP with Tie Bar	125 ¯C	-55 °C	Surface Mount	158	129024	2.7 V	2.3 V	600000	208-CQFP (75x75)
Microchip Technology APA600-FG676	676-BGA	70 °C	0 °C	Surface Mount	454	129024	2.7 V	2.3 V	600000	676-FBGA (27x27)
Microchip Technology APA600-FGG484I	484-BGA	85 °C	-40 °C	Surface Mount	370	129024	2.7 V	2.3 V	600000	484-FPBGA (23x23)
Microchip Technology APA600-FG256M	256-LBGA	125 °C	-55 °C	Surface Mount	186	129024	2.7 V	2.3 V	600000	256-FPBGA (17x17)
Microchip Technology APA600-FG676I	676-BGA	85 °C	-40 °C	Surface Mount	454	129024	2.7 V	2.3 V	600000	676-FBGA (27x27)

Catalog

Ultra Low Density FPGAs

Key Features

• * 7K logic elements

• * 126Kb RAM

• * 2 PLL in CCC

• * PCI

• * Temperature - Commercial, Industrial, Automotive, Military

Description

The ProASICPLUS family of devices, combines the advantages of ASICs with the benefits of programmable devices through nonvolatile flash technology. Key Features • Reprogrammable • Nonvolatile • Live at power-up • ASIC design flow • Very low power • PLLs and LVPECL I/O