MCP2021-330E/MD
ObsoleteLIN SYSTEM BASIS CHIP INCLUDING VOLTAGE REGULATOR
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MCP2021-330E/MD
ObsoleteLIN SYSTEM BASIS CHIP INCLUDING VOLTAGE REGULATOR
Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | MCP2021-330E/MD |
|---|---|
| Duplex | Half |
| Mounting Type | Surface Mount |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -40 °C |
| Package / Case | 8-VDFN Exposed Pad |
| Protocol | LINbus |
| Receiver Hysteresis | 175 mV |
| Supplier Device Package | 8-DFN (4x4) |
| Type | Transceiver |
| Voltage - Supply [Max] | 18 V |
| Voltage - Supply [Min] | 6 V |
| Part | Supplier Device Package | Package / Case | Type | Duplex | Receiver Hysteresis | Voltage - Supply [Max] | Voltage - Supply [Min] | Protocol | Operating Temperature [Max] | Operating Temperature [Min] | Mounting Type | Package / Case [y] | Package / Case [x] | Package / Case | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Microchip Technology | 8-DFN (4x4) | 8-VDFN Exposed Pad | Transceiver | Half | 175 mV | 18 V | 6 V | LINbus | 125 °C | -40 °C | Surface Mount | ||||
 Microchip Technology | 8-SOIC | 8-SOIC | Transceiver | Half | 175 mV | 18 V | 6 V | LINbus | 125 °C | -40 °C | Surface Mount | 3.9 mm | 0.154 in | ||
Microchip Technology | 8-DFN (4x4) | 8-VDFN Exposed Pad | Transceiver | Half | 175 mV | 18 V | 6 V | LINbus | 125 °C | -40 °C | Surface Mount | ||||
Microchip Technology | 8-SOIC | 8-SOIC | Transceiver | Half | 175 mV | 18 V | 6 V | LINbus | 125 °C | -40 °C | Surface Mount | 3.9 mm | 0.154 in | ||
 Microchip Technology | 8-PDIP | 8-DIP | Transceiver | Half | 175 mV | 18 V | 6 V | LINbus | 125 °C | -40 °C | Through Hole | 0.3 in | 7.62 mm | ||
Microchip Technology | 8-DFN (4x4) | 8-VDFN Exposed Pad | Transceiver | Half | 175 mV | 18 V | 6 V | LINbus | 125 °C | -40 °C | Surface Mount | ||||
Microchip Technology | 8-DFN (4x4) | 8-VDFN Exposed Pad | Transceiver | Half | 175 mV | 18 V | 6 V | LINbus | 125 °C | -40 °C | Surface Mount | ||||
Microchip Technology | 8-DFN (4x4) | 8-VDFN Exposed Pad | Transceiver | Half | 175 mV | 18 V | 6 V | LINbus | 125 °C | -40 °C | Surface Mount | ||||
Microchip Technology | 8-DFN (4x4) | 8-VDFN Exposed Pad | Transceiver | Half | 175 mV | 18 V | 6 V | LINbus | 125 °C | -40 °C | Surface Mount | ||||
Microchip Technology | 8-DFN (4x4) | 8-VDFN Exposed Pad | Transceiver | Half | 175 mV | 18 V | 6 V | LINbus | 125 °C | -40 °C | Surface Mount |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Microchip Direct | TUBE | 1 | $ 2.10 | |
| 25 | $ 1.73 | |||
| 100 | $ 1.58 | |||
| 1000 | $ 1.51 | |||
| 5000 | $ 1.50 | |||
Description
General part information
MCP2021 Series
The MCP2021 provides a bidirectional, half-duplex communication physical interface to an automotive and industrial Local Interconnect (LIN) and SAE J2602 bus. Operation covers LIN Bus Specification Versions 1.3, 2.0, 2.1 and SAE J2602. The device incorporates a voltage regulator with 5V/50mA or 3.3V/50mA output. The regulator is short-circuit protected and also includes thermal shutdown. The regulator has been specifically designed to operate in the automotive environment and will survive reverse battery conditions, +43V load dump transients and double-battery jump starts.
The device has been designed to meet the stringent quiescent current requirements of the automotive industry. The devices' very low emissions, excellent robustness to automotive transients and very high ESD robustness have been confirmed by independent test authorities.
Documents
Technical documentation and resources