
MCP2021 Series
Manufacturer: Microchip Technology

LIN TRANSCEIVER WITH VREG AND LIN FALLING EDGE WAKE 8 DFN 4X4X0.9MM TUBE ROHS COMPLIANT: YES
| Part | Supplier Device Package | Package / Case | Type | Duplex | Receiver Hysteresis | Voltage - Supply [Max] | Voltage - Supply [Min] | Protocol | Operating Temperature [Max] | Operating Temperature [Min] | Mounting Type | Package / Case [y] | Package / Case [x] | Package / Case | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology | 8-DFN (4x4) | 8-VDFN Exposed Pad | Transceiver | Half | 175 mV | 18 V | 6 V | LINbus | 125 °C | -40 °C | Surface Mount | ||||
Microchip Technology | 8-SOIC | 8-SOIC | Transceiver | Half | 175 mV | 18 V | 6 V | LINbus | 125 °C | -40 °C | Surface Mount | 3.9 mm | 0.154 in | ||
Microchip Technology | 8-DFN (4x4) | 8-VDFN Exposed Pad | Transceiver | Half | 175 mV | 18 V | 6 V | LINbus | 125 °C | -40 °C | Surface Mount | ||||
Microchip Technology | 8-SOIC | 8-SOIC | Transceiver | Half | 175 mV | 18 V | 6 V | LINbus | 125 °C | -40 °C | Surface Mount | 3.9 mm | 0.154 in | ||
Microchip Technology | 8-PDIP | 8-DIP | Transceiver | Half | 175 mV | 18 V | 6 V | LINbus | 125 °C | -40 °C | Through Hole | 0.3 in | 7.62 mm | ||
Microchip Technology | 8-DFN (4x4) | 8-VDFN Exposed Pad | Transceiver | Half | 175 mV | 18 V | 6 V | LINbus | 125 °C | -40 °C | Surface Mount | ||||
Microchip Technology | 8-DFN (4x4) | 8-VDFN Exposed Pad | Transceiver | Half | 175 mV | 18 V | 6 V | LINbus | 125 °C | -40 °C | Surface Mount | ||||
Microchip Technology | 8-DFN (4x4) | 8-VDFN Exposed Pad | Transceiver | Half | 175 mV | 18 V | 6 V | LINbus | 125 °C | -40 °C | Surface Mount | ||||
Microchip Technology | 8-DFN (4x4) | 8-VDFN Exposed Pad | Transceiver | Half | 175 mV | 18 V | 6 V | LINbus | 125 °C | -40 °C | Surface Mount | ||||
Microchip Technology | 8-DFN (4x4) | 8-VDFN Exposed Pad | Transceiver | Half | 175 mV | 18 V | 6 V | LINbus | 125 °C | -40 °C | Surface Mount |