Integrated Circuits (ICs)

M2GL090T-1FCSG325

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Microchip Technology

IGLOO2 LOW DENSITY FPGA, 86KLES 325 TFBGA 11X13.5X1.16MM TRAY ROHS COMPLIANT: YES

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Integrated Circuits (ICs)

M2GL090T-1FCSG325

Active

Microchip Technology

IGLOO2 LOW DENSITY FPGA, 86KLES 325 TFBGA 11X13.5X1.16MM TRAY ROHS COMPLIANT: YES

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Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	M2GL090T-1FCSG325

Mounting Type	Surface Mount
Number of I/O	180
Number of Logic Elements/Cells	86184
Operating Temperature [Max]	85 °C
Operating Temperature [Min]	0 °C
Package / Case	FCBGA, 325-TFBGA
Supplier Device Package	325-FCBGA (11x11)
Voltage - Supply [Max]	2.625 V
Voltage - Supply [Min]	1.14 V

M2GL090TS Series

More Resources in Low Density Devices

Part	Voltage - Supply [Max]	Voltage - Supply [Min]	Number of Logic Elements/Cells	Mounting Type	Supplier Device Package	Package / Case	Number of I/O	Operating Temperature [Max]	Operating Temperature [Min]
Microchip Technology M2GL090-1FCSG325I	2.625 V	1.14 V	86184	Surface Mount	325-FCBGA (11x11)	325-TFBGA FCBGA	180	100 °C	-40 C
Microchip Technology M2GL090-1FGG484I	2.625 V	1.14 V	86316	Surface Mount	484-FPBGA (23x23)	484-BGA	267 I/O	100 °C	-40 C
Microchip Technology M2GL090T-FGG484I	2.625 V	1.14 V	86184	Surface Mount	484-FPBGA (23x23)	484-BGA	267 I/O	100 °C	-40 C
Microchip Technology M2GL090TS-1FG676	2.625 V	1.14 V	86184	Surface Mount	676-FBGA (27x27)	676-BGA	425	85 °C	0 °C
Microchip Technology M2GL090T-1FCSG325	2.625 V	1.14 V	86184	Surface Mount	325-FCBGA (11x11)	325-TFBGA FCBGA	180	85 °C	0 °C
Microchip Technology M2GL090TS-1FGG676I	2.625 V	1.14 V	86316	Surface Mount	676-FBGA (27x27)	676-BGA	425	100 °C	-40 C
Microchip Technology M2GL090TS-1FGG484I	2.625 V	1.14 V	86316	Surface Mount	484-FPBGA (23x23)	484-BGA	267 I/O	100 °C	-40 C
Microchip Technology M2GL090T-FG676	2.625 V	1.14 V	86316	Surface Mount	676-FBGA (27x27)	676-BGA	425	85 °C	0 °C
Microchip Technology M2GL090TS-FGG484I	2.625 V	1.14 V	86184	Surface Mount	484-FPBGA (23x23)	484-BGA	267 I/O	100 °C	-40 C
Microchip Technology M2GL090-1FGG676	2.625 V	1.14 V	86316	Surface Mount	676-FBGA (27x27)	676-BGA	425	85 °C	0 °C

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tray	176	$ 147.35
Microchip Direct	TRAY	1	$ 162.08
		5	$ 157.58
		10	$ 153.32
		25	$ 151.27
		50	$ 149.28
		100	$ 147.35
		250	$ 143.62
		500	$ 136.70
		1000	$ 87.96
		5000	$ 79.34
Newark	Each	100	$ 147.35
		250	$ 143.62
		500	$ 136.70

Description

General part information

M2GL090TS Series

These flash FPGA devices are ideal for general purpose functions such as Gigabit Ethernet or dual PCI Express control planes, bridging functions, input/output (I/O) expansion and conversion, video/image processing, system management and secure connectivity. Microchip FPGAs are used by customers in Communications, Industrial, Medical, Defense, and Aviation markets.

More Resources in Low Density Devices

* Comprehensive microcontroller subsystem

Documents

Technical documentation and resources

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