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676 FBGA
Integrated Circuits (ICs)

M2GL090TS-1FGG676I

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Microchip Technology

IGLOO2 LOW DENSITY FPGA, 86KLES 676 PBGA 27X27X2.44MM TRAY ROHS COMPLIANT: YES

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676 FBGA
Integrated Circuits (ICs)

M2GL090TS-1FGG676I

Active
Microchip Technology

IGLOO2 LOW DENSITY FPGA, 86KLES 676 PBGA 27X27X2.44MM TRAY ROHS COMPLIANT: YES

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationM2GL090TS-1FGG676I
Mounting TypeSurface Mount
Number of I/O425
Number of Logic Elements/Cells86316
Operating Temperature [Max]100 °C
Operating Temperature [Min]-40 C
Package / Case676-BGA
Supplier Device Package676-FBGA (27x27)
Voltage - Supply [Max]2.625 V
Voltage - Supply [Min]1.14 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTray 40$ 295.48
Microchip DirectTRAY 1$ 316.58
5$ 307.78
10$ 299.47
25$ 295.48
50$ 291.59
100$ 287.81
250$ 280.52
500$ 266.99
1000$ 171.78
5000$ 154.97
NewarkEach 25$ 295.48
50$ 291.59
100$ 287.81
250$ 280.52
500$ 266.99

Description

General part information

M2GL090TS Series

These flash FPGA devices are ideal for general purpose functions such as Gigabit Ethernet or dual PCI Express control planes, bridging functions, input/output (I/O) expansion and conversion, video/image processing, system management and secure connectivity. Microchip FPGAs are used by customers in Communications, Industrial, Medical, Defense, and Aviation markets.

More Resources in Low Density Devices

* Comprehensive microcontroller subsystem

Documents

Technical documentation and resources

No documents available