Connectors, Interconnects

14-C280-30

Active

CONN IC DIP SOCKET 14POS GOLD

Search across all available documentation for this part.

Connectors, Interconnects

Active

CONN IC DIP SOCKET 14POS GOLD

Technical Specifications

Parameters and characteristics for this part

Specification	14-C280-30

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	0.25 µm
Contact Finish Thickness - Mating	10 µin
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Current Rating (Amps)	3 A
Features	Closed Frame
Housing Material	Polyamide (PA46), Nylon 4/6, Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Surface Mount
Number of Positions or Pins (Grid)	14
Operating Temperature [Max]	105 ░C
Operating Temperature [Min]	-55 C
Pitch - Mating	0.1 "
Pitch - Mating	2.54 mm
Pitch - Post	0.1 in
Pitch - Post	2.54 mm
Termination	Solder
Termination Post Length	0.04 in
Termination Post Length	1.02 mm
Type	7.62 mm
Type	0.3 in
Type	DIP

Part	Termination Post Length	Termination Post Length	Current Rating (Amps)	Material Flammability Rating	Pitch - Mating	Pitch - Mating	Contact Material - Mating	Termination	Pitch - Post	Pitch - Post	Mounting Type	Features	Number of Positions or Pins (Grid)	Type	Type	Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Mating	Contact Material - Post [custom]	Contact Finish - Post	Housing Material	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Operating Temperature [Min]	Operating Temperature [Max]
Aries Electronics 14-C280-31	0.04 in	1.02 mm	3 A	UL94 V-0	0.1 "	2.54 mm	Beryllium Copper	Solder	0.1 in	2.54 mm	Surface Mount	Closed Frame	14	7.62 mm	0.3 in	DIP	10 Áin	0.25 çm	Gold	Brass	Gold	Polyamide (PA46) Nylon 4/6 Glass Filled	0.25 µm	10 µin	-55 C	125 °C
Aries Electronics 14-C280-30	0.04 in	1.02 mm	3 A	UL94 V-0	0.1 "	2.54 mm	Beryllium Copper	Solder	0.1 in	2.54 mm	Surface Mount	Closed Frame	14	7.62 mm	0.3 in	DIP	200 µin	5.08 µm	Gold	Brass	Tin	Polyamide (PA46) Nylon 4/6 Glass Filled	0.25 µm	10 µin	-55 C	105 ░C
Aries Electronics 14-C280-10	0.125 in	3.18 mm	3 A	UL94 V-0	0.1 "	2.54 mm	Beryllium Copper	Solder	0.1 in	2.54 mm	Through Hole	Closed Frame	14	7.62 mm	0.3 in	DIP	200 µin	5.08 µm	Gold	Brass	Tin	Polyamide (PA46) Nylon 4/6 Glass Filled	0.25 µm	10 µin	-55 C	105 ░C
Aries Electronics 14-C280-10T	0.125 in	3.18 mm	3 A	UL94 V-0	0.1 "	2.54 mm	Beryllium Copper	Solder	0.1 in	2.54 mm	Through Hole	Closed Frame	14	7.62 mm	0.3 in	DIP	200 µin	5.08 µm		Brass	Tin	Polyamide (PA46) Nylon 4/6 Glass Filled	5.08 µm	200 µin	-55 C	105 ░C

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

14 (2 x 7) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Surface Mount

Technical documentation and resources