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32-6570-11
Connectors, Interconnects

32-6570-11

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Aries Electronics

CONN IC DIP SOCKET ZIF 32POS GLD

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32-6570-11
Connectors, Interconnects

32-6570-11

Active
Aries Electronics

CONN IC DIP SOCKET ZIF 32POS GLD

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

Specification32-6570-11
Contact Finish - MatingGold
Contact Finish - PostGold
Contact Finish Thickness - Mating0.25 µm
Contact Finish Thickness - Mating10 µin
Contact Finish Thickness - Post10 Áin
Contact Finish Thickness - Post0.25 çm
Contact Material - MatingBeryllium Copper
Contact Material - PostBeryllium Copper
Current Rating (Amps)1 A
FeaturesClosed Frame
Housing MaterialPolyphenylene Sulfide (PPS), Glass Filled
Material Flammability RatingUL94 V-0
Mounting TypeThrough Hole
Number of Positions or Pins (Grid)32
Pitch - Mating0.1 "
Pitch - Mating2.54 mm
Pitch - Post0.1 in
Pitch - Post2.54 mm
TerminationSolder
Termination Post Length0.11 in
Termination Post Length2.78 mm
TypeZIF (ZIP), DIP
Type0.6 " (15.24mm) Row Spacing

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 18$ 26.67
N/A 0$ 31.21

Description

General part information

32-6570 Series

32 (2 x 16) Pos DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources