32-6570 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN IC DIP SOCKET ZIF 32POS TIN
| Part | Current Rating (Amps) | Material Flammability Rating | Termination Post Length | Termination Post Length | Pitch - Post | Pitch - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Features | Number of Positions or Pins (Grid) | Housing Material | Mounting Type | Contact Material - Mating | Type | Type | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Termination | Contact Finish - Post | Contact Material - Post | Contact Finish - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 1 A | UL94 V-0 | 0.11 in | 2.78 mm | 0.1 in | 2.54 mm | 5.08 µm | 200 µin | Closed Frame | 32 | Polyphenylene Sulfide (PPS) Glass Filled | Through Hole | Beryllium Copper | DIP ZIF (ZIP) | 0.6 " (15.24mm) Row Spacing | 0.1 " | 2.54 mm | 200 µin | 5.08 µm | Solder | Tin | Beryllium Copper | |
Aries Electronics | 1 A | UL94 V-0 | 0.11 in | 2.78 mm | 0.1 in | 2.54 mm | 0.25 µm | 10 µin | Closed Frame | 32 | Polyphenylene Sulfide (PPS) Glass Filled | Through Hole | Beryllium Copper | DIP ZIF (ZIP) | 0.6 " (15.24mm) Row Spacing | 0.1 " | 2.54 mm | 10 Áin | 0.25 çm | Solder | Gold | Beryllium Copper | Gold |